Erick G. Walton | Researchain

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Featured researches published by Erick G. Walton.

Archive | 1990

Aluminum bump, reworkable bump, and titanium nitride structure for tab bonding

Michael John Brady; Sung K. Kang; Paul Andrew Moskowitz; James Gardner Ryan; Timothy Clark Reiley; Erick G. Walton; Harry Randall Bickford; Michael J. Palmer

Archive | 1990

Solder mass having conductive encapsulating arrangement

Birendra N. Agarwala; Aziz M. Ahsan; Arthur Bross; Mark F. Chadurjian; Nicholas George Koopman; Li-Chung Lee; Karl J. Puttlitz; Sudipta K. Ray; James Gardner Ryan; Joseph George Schaefer; Kamalesh K. Srivastava; Paul Anthony Totta; Erick G. Walton; Adolf Ernest Wirsing

Archive | 1992

Method of forming dual height solder interconnections

Archive | 1988

Chromium-titanium alloy

David Alan Gardner; James Gardner Ryan; Joseph George Schaefer; Erick G. Walton

Archive | 1997

Polishing pad with controlled release of desired micro-encapsulated polishing agents

Matthew Kilpatrick Miller; Clifford Owen Morgan; Matthew J. Rutten; Erick G. Walton; Terrance M. Wright

Archive | 1985

Method for a plasma-treated polysiloxane coating

Donna Jean Clodgo; Rosemary A. Previti-Kelly; Erick G. Walton

Archive | 1999

Electroplating apparatus and method using a compressible contact

Erick G. Walton; Dean S. Chung; Lara Sandra Collins; William E. Corbin; Hariklia Deligianni; Daniel C. Edelstein; James E. Fluegel; Josef Warren Korejwa; Peter S. Locke

Archive | 1996