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Dive into the research topics where James E. Fluegel is active.

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Featured researches published by James E. Fluegel.


Archive | 1999

Electroplating apparatus and method using a compressible contact

Erick G. Walton; Dean S. Chung; Lara Sandra Collins; William E. Corbin; Hariklia Deligianni; Daniel C. Edelstein; James E. Fluegel; Josef Warren Korejwa; Peter S. Locke


Archive | 1999

Method of controlling chemical bath composition in a manufacturing environment

John O. Dukovic; William E. Corbin; Erick G. Walton; Peter S. Locke; Panayotis C. Andricacos; James E. Fluegel; Evan E. Patton; Jonathan D. Reid


Archive | 2000

Electroplating apparatus with vertical electrical contact

James E. Fluegel; Peter S. Locke; Yuet-Ying Yu


Archive | 1999

Copper seed layer repair technique using electroless touch-up

Panayotis C. Andricacos; James E. Fluegel; John G. Gaudiello; Ronald D. Goldblatt; Sandra G. Malhotra


Archive | 2002

Method of forming planar Cu interconnects without chemical mechanical polishing

Soon-Cheon Seo; Wei-Tsu Tseng; Darryl D. Restaino; James E. Fluegel; Richard O. Henry; John M. Cotte; Mahadevaiyer Krishnan; Hariklia Deligianni; Philippe M. Vereecken; Stephen E. Greco


Archive | 1998

Method and apparatus for making electrical contact to a substrate during electroplating

Glen N. Biggs; Donald M. Brewer; James E. Fluegel; Suryanarayana Kaja; Ashwani K. Malhotra; Phillip W. Palmatier


Archive | 2007

MANUFACTURABLE CoWP METAL CAP PROCESS FOR COPPER INTERCONNECTS

Darryl D. Restaino; Donald F. Canaperi; Judith M. Rubino; Sean P. E. Smith; Richard O. Henry; James E. Fluegel; Mahadevaiyer Krishnan


Archive | 2003

Void-free damascene copper deposition process and means of monitoring thereof

Panayotis C. Andricacos; Dean S. Chung; Hariklia Deligianni; James E. Fluegel; Keith T. Kwietniak; Peter S. Locke; Darryl D. Restaino; Soon-Cheon Seo; Philippe M. Vereecken; Erick G. Walton


Archive | 2008

Ic waper carrier sealed from ambient atmosphere during transportation from one process to the next

William E. Corbin; Alison K. Easton; James E. Fluegel; Christopher W. Long; James H. Peterman; Laura Mauer


Archive | 2004

Electroplated copper interconnection structure, process for making and electroplating bath

Panayotis C. Andricacos; Steven H. Boettcher; Dean S. Chung; Hariklia Deligianni; James E. Fluegel; Wilma Jean Horkans; Keith T. Kwietniak; Peter S. Locke; Christopher Parks; Soon-Cheon Seo; Andrew H. Simon; Erick G. Walton

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