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Ewald Stückler

ams AG

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Publication

Featured researches published by Ewald Stückler.

Archive | 2011

Verfahren zur Herstellung eines Halbleiterbauelements für 3D-Integration

Bernhard Löffler; Franz Schrank; Ewald Stückler

Archive | 2011

Method for manufacturing semiconductor component that is three-dimensionally integrated in semiconductor chip stack, involves selectively removing upper stop layer with respect to lower stop layer

Bernhard Löffler; Franz Schrank; Ewald Stückler

Archive | 2012

Method for producing a semiconductor device comprising a conductor layer in the semiconductor body and semiconductor body

Rainer Minixhofer; Ewald Stückler; Martin Schrems; Günther Koppitsch; Jochen Kraft; Jordi Teva

Archive | 2012

Herstellungsverfahren für ein Halbleiterbauelement mit einer Leiterschicht im Halbleiterkörper und Halbleiterbauelement

Rainer Minixhofer; Ewald Stückler; Martin Schrems; Günther Koppitsch; Jochen Kraft; Jordi Teva

Archive | 2002

Silicon substrate having an insulating layer

Ewald Stückler; Günther Koppitsch

Archive | 2014

Semiconductor device with integrated mirror and method of producing a semiconductor device with integrated mirror

Jochen Kraft; Jörg Siegert; Ewald Stückler

Archive | 2013

Lateral single-photon avalanche diode and their manufacturing method

Jordi Teva; Frederic Roger; Ewald Stückler; Stefan Jessenig; Rainer Minixhofer; Ewald Wachmann; Martin Schrems; Günther Koppitsch

international conference on thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems | 2012

A novel wafer -level test method to measure the bond strength in microelectronic materials

Sara Carniello; Jörg Siegert; Bernhard Löffler; Ewald Stückler

Archive | 2012

Method for producing a semiconductor component comprising a conductor layer in the semiconductor body and semiconductor component

Rainer Minixhofer; Ewald Stückler; Martin Schrems; Günther Koppitsch; Jochen Kraft; Jordi Teva

Archive | 2011

Herstellungsverfahren für ein Halbleiterbauelement mit einer Leiterschicht im Halbleiterkörper und Halbleiterbauelement Manufacturing method for a semiconductor device having a conductor layer in the semiconductor body and the semiconductor component

Rainer Minixhofer; Ewald Stückler; Martin Schrems; Koppitsch Günther; Kraft Jochen; Jordi Teva

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Günther Koppitsch

ams AG

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Jordi Teva

ams AG

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Martin Schrems

ams AG

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Bernhard Löffler

ams AG

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Jochen Kraft

ams AG

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Franz Schrank

ams AG

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Rainer Minixhofer

IBM

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Jörg Siegert

ams AG

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Rainer Minixhofer

IBM

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Ewald Wachmann

ams AG

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