F. Soares

LARGE-AREA 1D THIN-FILM POSITION-SENSITIVE DETECTOR WITH HIGH DETECTION RESOLUTION

Abstract The aim of this work is to present the main optoelectronic characteristics of large-area one-dimensional position-sensitive detectors (1D TFPSDs) based on amorphous silicon (a-Si) p-i-n diodes. From that, the device resolution, response time and detectivity (defined as being the reciprocal of the noise equivalent power pattern) are derived and discussed concerning the field of applications of the 1D TFPSDs.

32 linear array position sensitive detector based on NIP and hetero a-Si:H microdevices

Abstract In this paper we present results concerning the performance exhibited by an integrated array of 32 one-dimensional amorphous silicon thin film position sensitive detectors based on nip and hetero amorphous silicon structures, with a total active area size below 1 cm 2 . The main emphasis will be put on the devices linearity, its spatial resolution and response time, that make it one of the most interesting analog detector to be used in unmanned optical inspection control systems where a continuous detection process is required. This opens a wide range of applications for amorphous silicon devices in the area of image processing.

High-detection resolution presented by large-area thin-film position-sensitive detectors

The aim of this work is to present the main optoelectronic characteristics of large area 1D position sensitive detectors based on amorphous silicon p-i-n diodes. From that, the device resolution, response time and detectivity are derived and discussed concerning the field of applications of the 1D thin film position sensitive detectors.

A New Linear Array Thin Film Position Sensitive Detector (LTFPSD) for 3D Measurements

A Linear array Thin Film Position Sensitive Detector (LTFPSD) based on hydrogenated amorphous silicon (a-Si:H) is proposed for the first time, taking advantage of the optical properties presented by a-Si:H devices we have developed a LTFPSD with 128 integrated elements able to be used in 3D inspections/measurements. Each element consists on an one-dimensional TFPSD, based on a p.i.n diode produced in a conventional PECVD system, where the doped layers are coated with thin resistive layers to establish the required device equipotentials. By proper incorporation of the LTFPSD into an optical inspection camera it will be possible to acquire information about an object/surface, through the optical cross-section method 1 . The main advantages of this system, when compared with the conventional CCDs, are the low complexity of hardware and software used and that the information can be continuously processed (analogue detection).

A-Si:H ambipolar diffusion length and effective lifetime measured by flying spot (FST) and spectral photovoltage (SPT) techniques

On this paper we report the physical model that supports the theory of the Flying Spot Technique (FST). Through this technique it is possible to determine separately the ambipolar diffusion length (L*) and the effective lifetime (τ*) of the generated carriers, using either Schottky diodes or quasi-ohmic sandwich structures. We also report a new static method based on the Spectral Photovoltage (SPT) that allows to infer the ambipolar diffusion length and to estimate the surface recombination velocity.

Characteristics of a linear array of a-Si:H thin film position sensitive detector

Abstract The increasing demand in automation processes in finishing techniques also calls for automatic measurement and inspection methods. These methods ought to be installed as close as possible to the production process and they ought to measure the values needed in a safe and fast way, without disturbing the process itself. Simultaneously they should be free of wear and insensitive against mechanical perturbations. This approach can be reached by proper combination of the laser triangulation technique with an array of linear position sensitive detectors, able to supply information about the surface finishing of an object. This is the aim of this paper that envisages to present experimental results of the performances exhibited by such an array constituting 128 elements. The analogue information supplied by this array is processed by an analogue/digital converter, directly coupled to the array and whose information is computer processed, concerning the recognition of patterns and the processing of information collected over the object to be inspected.

Linear thin-film position-sensitive detector (LTFPSD) for 3D measurements

A linear array thin film position sensitive detector (LTFPSD) based on hydrogenated amorphous silicon (a-Si:H) is proposed for the first time, taking advantage of the optical properties presented by a-Si:H devices we have developed a LTFPSD with 128 integrated elements able to be used in 3-D inspections/measurements. Each element consists on a one- dimensional LTFPSD, based on a p.i.n. diode produced in a conventional PECVD system, where the doped layers are coated with thin resistive layers to establish the required device equipotentials. By proper incorporation of the LTFPSD into an optical inspection camera it is possible to acquire information about an object/surface, through the optical cross-section method. The main advantages of this system, when compared with the conventional CCDs, are the low complexity of hardware and software used and that the information can be continuously processed (analogue detection).

Thin films applied to integrated optical position-sensitive detectors

We have developed a linear thin film position-sensitive detector with 128 elements, based on p.i.n. a-Si:H devices. The incorporation of this sensor into an optical inspection camera makes possible the acquisition of three-dimensional information of an object, using laser triangulation methods. The main advantages of this system, when compared with the conventional charge-coupled devices, are the low complexity of hardware and software used, and that the information can be continuously processed (analogic detection). In this paper, we present the most significant characteristics of the singular one-dimensional thin film position-sensitive detectors that form part of the linear array with 128 sensors.

A linear array thin film position sensitive detector for 3D measurements

Abstract A novel compact linear thin film position sensitive detector with 128 elements, based on p-i-n a-Si:H devices was developed. The proper incorporation of this sensor into an optical inspection camera makes possible the acquisition of three dimension information of an object, using laser triangulation methods. The main advantages of this system, when compared with the conventional charge-coupled devices, are the low complexity of hardware and software used and that the information can be continuously processed (analogue detection).

A linear array position sensitive detector based on amorphous silicon

A linear array thin film position sensitive detector (LTFPSD) based on hydrogenated amorphous silicon (a‐Si:H) is proposed for the first time. Taking advantage of the optical properties presented by a‐Si:H devices, we have developed a LTFPSD with 128 integrated elements able to be used in 3D inspections/measurements. Each element consists of a one‐dimensional LTFPSD, based on a p‐i‐n diode produced in a conventional PECVD system, where the doped layers are coated with thin resistive layers to establish the required device equipotentials. By proper incorporation of the LTFPSD into an optical inspection camera it will be possible to acquire information about an object/surface, through the optical cross‐section method. The main advantages of this system, when compared with the conventional CCDs, are the low complexity of hardware and software used and that the information can be continuously processed (analog detection).