Fabrice Lallement

Challenges and Progress in Germanium-on-Insulator Materials and Device Development towards ULSI Integration

SOITEC, Parc Technologique des Fontaines, F38190, Bernin, France The recent progress in the fabrication of GeOI substrates and devices is reviewed. Improvements have been made in threading dislocation density, Ge-buried oxide interface passivation, device performance. The potential of various co-integration schemes (lateral and vertical) has been illustrated as alternatives to the fabrication of n-type germanium channel devices. GeOI is also shown to be a versatile platform for the monolithic integration of Si and III-V devices and tunneling field effect transistors.

Splitting kinetics of Si0.8Ge0.2 layers implanted with H or sequentially with He and H

We have performed systematic measurements of the splitting kinetics induced by H-only and He+H sequential ion implantation into relaxed Si0.8Ge0.2 layers and compared them with the data obtained in Si. For H-only implants, Si splits faster than Si0.8Ge0.2. Sequential ion implantation leads to faster splitting kinetics than H-only in both materials and is faster in Si0.8Ge0.2 than in Si. We have performed secondary ion mass spectrometry, Rutherford backscattering spectroscopy in channeling mode, and transmission electron microscopy analyses to elucidate the physical mechanisms involved in these splitting phenomena. The data are discussed in the framework of a simple phenomenological model in which vacancies play an important role.