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Warren M. Farnworth

Micron Technology

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Publication

Featured researches published by Warren M. Farnworth.

Archive | 1996

Single piece package for semiconductor die

Salman Akram; Alan G. Wood; Warren M. Farnworth

Archive | 1998

Stackable chip scale semiconductor package with mating contacts on opposed surfaces

Salman Akram; Alan G. Wood; Warren M. Farnworth

Archive | 2003

Multi-dice chip scale semiconductor components and wafer level methods of fabrication

Warren M. Farnworth; Alan G. Wood; William M. Hiatt; James M. Wark; David R. Hembree; Kyle K. Kirby; Pete A. Benson

Archive | 1995

Method of producing a single piece package for semiconductor die

Salman Akram; Alan G. Wood; Warren M. Farnworth

Archive | 1991

High-density electronic package comprising stacked sub-modules which are electrically interconnected by solder-filled vias

Angus C. Fox; Warren M. Farnworth

Archive | 1997

Semiconductor package including flex circuit, interconnects and dense array external contacts

Warren M. Farnworth; Alan G. Wood; Mike Brooks

Archive | 1998

Stacked semiconductor package and method of fabrication

Warren M. Farnworth; Alan G. Wood; Mike Brooks

Archive | 1999

Method for fabricating stackable chip scale semiconductor package

Salman Akram; Alan G. Wood; Warren M. Farnworth

Archive | 1994

Method for fabricating a self limiting silicon based interconnect for testing bare semiconductor dice

Salman Akram; Warren M. Farnworth; Alan G. Wood

Archive | 1994

Carrier for testing an unpackaged semiconductor die

Alan G. Wood; Warren M. Farnworth; David R. Hembree

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Alan G. Wood

Micron Technology

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Salman Akram

Micron Technology

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David R. Hembree

Micron Technology

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William M. Hiatt

Micron Technology

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Kyle K. Kirby

Micron Technology

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James M. Wark

Micron Technology

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Larry D. Kinsman

Micron Technology

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Walter L. Moden

Micron Technology

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John O. Jacobson

Micron Technology

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Kevin G. Duesman

Micron Technology

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