Alan G. Wood

Single piece package for semiconductor die

Stackable chip scale semiconductor package with mating contacts on opposed surfaces

Multi-dice chip scale semiconductor components and wafer level methods of fabrication

Method of producing a single piece package for semiconductor die

Semiconductor package including flex circuit, interconnects and dense array external contacts

Stacked semiconductor package and method of fabrication

Method for fabricating stackable chip scale semiconductor package

Method for fabricating a self limiting silicon based interconnect for testing bare semiconductor dice

Discrete die burn-in for nonpackaged die

Carrier for testing an unpackaged semiconductor die