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Latest external collaboration on country level. Dive into details by clicking on the dots.

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Dive into the research topics where Randall J. Stutzman is active.

Publication


Featured researches published by Randall J. Stutzman.


Archive | 2001

EMI shielding for semiconductor chip carriers

David J. Alcoe; Jeffrey T. Coffin; Michael A. Gaynes; Harvey C. Hamel; Mario J. Interrante; Brenda L. Peterson; Megan J. Shannon; William E. Sablinski; Christopher Todd Spring; Randall J. Stutzman; Renee L. Weisman; Jeffrey A. Zitz


Archive | 2002

Liquid metal thermal interface for an electronic module

Varaprasad V. Calmidi; Eric A. Johnson; Randall J. Stutzman


Archive | 2003

Thermally enhanced lid for multichip modules

David J. Alcoe; William L. Brodsky; Varaprasad V. Calmidi; Sanjeev B. Sathe; Randall J. Stutzman


Archive | 2001

High performance chip packaging and method

Timothy F. Carden; Glenn O. Dearing; Kishor V. Desai; Stephen Robert Engle; Randall J. Stutzman; George H. Thiel


Archive | 1990

Electronic assembly with enhanced heat sinking

Don L. Baker; Joseph Funari; William Fred Otto; Bahgat Sammakia; Randall J. Stutzman


Archive | 1999

Enhanced heat-dissipating printed circuit board package

Stephen W. MacQuarrie; Randall J. Stutzman; Jerzy M. Zalesinski


Archive | 2002

Module with adhesively attached heat sink

David J. Alcoe; Thomas W. Dalrymple; Michael A. Gaynes; Randall J. Stutzman


Archive | 1998

Thermal/electrical break for printed circuit boards

Bruce J. Chamberlin; Mitchell G. Ferrill; Randall J. Stutzman; George H. Thiel


Archive | 2002

Stress-relieving heatsink structure and method of attachment to an electronic package

David J. Alcoe; Randall J. Stutzman


Archive | 2003

Packaging for multi-processor shared-memory system

Harm Peter Hofstee; Eric A. Johnson; Randall J. Stutzman; Jamil A. Wakil

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