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Kishor V. Desai

LSI Corporation

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Publication

Featured researches published by Kishor V. Desai.

Archive | 1997

Die clip assembly for semiconductor package

Kishor V. Desai; Sunil A. Patel; John P. McCormick

Archive | 2000

Interposer for semiconductor package assembly

Maniam Alagaratnam; Kishor V. Desai; Sunil A. Patel

Archive | 1999

Flip chip ball grid array package with laminated substrate

Kumar Nagarajan; Kishor V. Desai

Archive | 2004

Method and apparatus for establishing improved thermal communication between a die and a heatspreader in a semiconductor package

Kishor V. Desai; Maniam Alagaratnam

Archive | 2013

SOLDER INTERCONNECT BY ADDITION OF COPPER

Mark Adam Bachman; John W. Osenbach; Kishor V. Desai

Archive | 1997

Integrated heat spreader/stiffener assembly and method of assembly for semiconductor package

Kishor V. Desai; Sunil A. Patel; John P. McCormick

Archive | 2000

Method for attaching solderballs by selectively oxidizing traces

John P. McCormick; Kishor V. Desai

Archive | 1999

Apparatus and method for improving ball joints in semiconductor packages

Sunil A. Patel; Chok J. Chia; Kishor V. Desai

Archive | 2001

Method for manufacturing a dual chip in package with a flip chip die mounted on a wire bonded die

Sarathy Rajagopalan; Kishor V. Desai

Archive | 2001

Dual chip in package with a wire bonded die mounted to a substrate

Sarathy Rajagopalan; Kishor V. Desai; Maniam Alagaratnam

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Maniam Alagaratnam

LSI Corporation

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John P. McCormick

LSI Corporation

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Sarathy Rajagopalan

LSI Corporation

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Sunil A. Patel

LSI Corporation

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John W. Osenbach

LSI Corporation

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Shirish Shah

LSI Corporation

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Chok J. Chia

LSI Corporation

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Kumar Nagarajan

LSI Corporation

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Mark A. Bachmann

LSI Corporation

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Mark Adam Bachman

LSI Corporation

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