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Dive into the research topics where Wayne J. Howell is active.

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Featured researches published by Wayne J. Howell.


Fluid Phase Equilibria | 1989

An improved mosced equation for the prediction and application of infinite dilution activity coefficients

Wayne J. Howell; Anna M. Karachewski; Kevin M. Stephenson; Charles A. Eckert; Jung Hag Park; Peter W. Carr; Sarah C. Rutan

Abstract Infinite dilution activity coefficients are a valuable tool in separation process design. They are used as a direct indication of unlike pair interactions; they are often relatively straightforward to measure or estimate; and their application can frequently save extensive experimental or computational effort. The initial development of the MOSCED equation was limited by the inadequacy of scales of acidity-basicity available at the time, resulting in a large number of adjustable parameters. Recently, spectroscopic and other physico-chemical data have become available that can be used to improve greatly the quantitative estimation of the various molecular interactions in solution. One such set of spectroscopic data that provide an accurate and easily obtainable measure of the acid-base interactions in solution is the solvatochromic acidity/basicity scale. We have used this extensive database to evaluate the chemical interaction term in the MOSCED model, and substantially reduce the number of adjustable parameters with no significant change in accuracy. The results may lead to a much better basic understanding of solution interactions.


JOM | 1988

Carbothermic Reduction Using Liquid Metal Solvents

Wayne J. Howell; Charles A. Eckert; Robert N. Anderson

The use of liquid metal solvents has broadened the application-potential of carbothermic reduction in the areas of ore reduction reactions and reactive separations. A properly chosen solvent permits pyrometallurgical reductions at temperatures far below those possible with processes that do not employ a solvent metal. Product contamination is inhibited as well. Further, solvated carbothermic reduction appears to consume substantially less energy than conventional electrochemical and metallothermic processes.


Archive | 1998

Highly integrated chip-on-chip packaging

Claude L. Bertin; Thomas G. Ference; Wayne J. Howell; Edmund J. Sprogis


Archive | 1994

Semiconductor stack structures and fabrication/sparing methods utilizing programmable spare circuit

Claude L. Bertin; Erik L. Hedberg; Wayne J. Howell


Archive | 1995

Method and workpiece for connecting a thin layer to a monolithic electronic module's surface and associated module packaging

Kenneth E. Beilstein; Claude L. Bertin; John Edward Cronin; Wayne J. Howell; James M. Leas; David Jacob Perlman


Archive | 2000

Through-chip conductors for low inductance chip-to-chip integration and off-chip connections

Claude L. Bertin; Wayne J. Howell; William R. Tonti; Jerzy M. Zalesinski


Archive | 1993

Integrated multichip memory module structure

Claude L. Bertin; Wayne J. Howell; Erik L. Hedberg; Howard K. Kalter; Gordon Arthur Kelley


Archive | 1995

Methods for precise definition of integrated circuit chip edges

John Edward Cronin; Wayne J. Howell; Howard Leo Kalter; Patricia E. Marmillion; Anthony M. Palagonia; Bernadette Ann Pierson; Dennis Arthur Schmidt


Archive | 1993

Integrated memory cube structure

Claude L. Bertin; Wayne J. Howell; Erik L. Hedberg; Howard Leo Kalter; Gordon Arthur Kelley


Archive | 1994

Integrated mulitchip memory module, structure and fabrication

Claude L. Bertin; Wayne J. Howell; Erik L. Hedberg; Howard Leo Kalter; Gordon Arthur Kelley

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