H.A. Mantooth

Power Conversion With SiC Devices at Extremely High Ambient Temperatures

This paper evaluates the capability of SiC devices for operation under extremely high ambient temperatures. To this end, the authors packaged SiC JFET and Schottky barrier diodes (SBD) in thermally stable packages and built a high-temperature inductor to be evaluated in a DC-DC buck converter. The DC characteristics of the SiC JFET devices were first measured at ambient temperatures ranging from room temperature up to 450 degC. The experimental results show that the device can operate at 450 degC, which is impossible for conventional Si devices, but as expected the current capability of the SiC JFET diminishes with rising temperatures. A DC-DC converter was then designed and built in accordance with the static characteristics of the SiC JFETs that were measured under extremely high ambient temperatures. The converter was tested up to an ambient temperature of 400 degC. The conduction loss of the SiC JFET increases slightly, as predicted from its DC characteristics, but its switching characteristics hardly change with increasing temperatures. Thus, SiC devices are well suited for operation in harsh temperature environments

Silicon Carbide Power MOSFET Model and Parameter Extraction Sequence

A compact circuit simulator model is used to describe the performance of a 2-kV, 5-A 4-H silicon carbide (SiC) power DiMOSFET and to perform a detailed comparison with the performance of a widely used 400-V, 5-A Si power MOSFET. The models channel current expressions are unique in that they include the channel regions at the corners of the square or hexagonal cells that turn on at lower gate voltages and the enhanced linear region transconductance due to diffusion in the nonuniformly doped channel. It is shown that the model accurately describes the static and dynamic performance of both the Si and SiC devices and that the diffusion-enhanced channel conductance is essential to describe the SiC DiMOSFET on-state characteristics. The detailed device comparisons reveal that both the on-state performance and switching performance at 25degC are similar between the 400-V Si and 2-kV SiC MOSFETs, with the exception that the SiC device requires twice the gate drive voltage. The main difference between the devices is that the SiC has a five times higher voltage rating without an increase in the specific on-resistance. At higher temperatures (above 100degC), the Si device has a severe reduction in conduction capability, whereas the SiC on-resistance is only minimally affected

A 55-kW Three-Phase Inverter With Si IGBTs and SiC Schottky Diodes

Silicon carbide (SiC) power devices are expected to have an impact on power converter efficiency, weight, volume, and reliability. Currently, only SiC Schottky diodes are commercially available at relatively low current ratings. Oak Ridge National Laboratory has collaborated with Cree and Semikron to build a Si insulated-gate bipolar transistor-SiC Schottky diode hybrid 55-kW inverter by replacing the Si p-n diodes in Semikrons automotive inverter with Crees made-to-order higher current SiC Schottky diodes. This paper presents the developed models of these diodes for circuit simulators, shows inverter test results, and compares the results with those of a similar all-Si inverter.

Transient Electrothermal Simulation of Power Semiconductor Devices

In this paper, a new thermal model based on the Fourier series solution of heat conduction equation has been introduced in detail. 1-D and 2-D Fourier series thermal models have been programmed in MATLAB/Simulink. Compared with the traditional finite-difference thermal model and equivalent RC thermal network, the new thermal model can provide high simulation speed with high accuracy, which has been proved to be more favorable in dynamic thermal characterization on power semiconductor switches. The complete electrothermal simulation models of insulated gate bipolar transistor (IGBT) and power diodes under inductive load switching condition have been successfully implemented in MATLAB/Simulink. The experimental results on IGBT and power diodes with clamped inductive load switching tests have verified the new electrothermal simulation model. The advantage of Fourier series thermal model over widely used equivalent RC thermal network in dynamic thermal characterization has also been validated by the measured junction temperature.

Silicon carbide PiN and merged PiN Schottky power diode models implemented in the Saber circuit simulator

Dynamic electrothermal circuit simulator models are developed for silicon carbide power diodes. The models accurately describe the temperature dependence of on-state characteristics and reverse-recovery switching waveforms. The models are verified for the temperature dependence of the on-state characteristics, and the di/dt, dv/dt, and temperature dependence of the reverse-recovery characteristics. The model results are presented for 1500 V SiC Merged PiN Schottky (MPS) diodes, 600 V Schottky diodes, and 5000 V SiC PiN diodes. The devices studied have current ratings from 0.25 A to 5 A and have different lifetimes resulting in different switching energy versus on-state voltage trade-offs. The devices are characterized using a previously reported test system specifically designed to emulate a wide range of application conditions by independently controlling the applied diode voltage, forward diode current, di/dt, and dv/dt at turn-off. A behavioral model of the test system is implemented to simulate and validate the models. The models are validated for a wide range of application conditions for which the diode could be used.

Assessing the Impact of SiC MOSFETs on Converter Interfaces for Distributed Energy Resources

Distributed energy resources (DERs) are becoming integral components of electric power distribution systems. In most cases, an isolated DC-DC converter forms part of the interface required to connect the DER output to the distribution system. Operation of the converter at high switching frequencies results in size reduction of passive components at the expense of increased switching losses. However, silicon carbide (SiC) power devices have the potential of operating at high switching frequencies without significant loss penalty because of their fast switching times and ability to work at high temperatures when compared to similar Si devices. SiC diodes have already displayed the ability to offer more ideal diode behavior than Si diodes. Engineering samples of SiC MOSFETs are depicting lower switching losses and conduction losses over Si MOSFETs. This display is making SiC devices attractive for DC-DC converters used to connect DERs to the distribution system. This paper particularly deals with the design of a 300 W 100 kHz DC-DC full-bridge converter using zero-voltage zero-current switching for comparison of SiC MOSFETs and diodes against Si MOSFETs and diodes.

Modeling nonlinear dynamics in analog circuits via root localization

An algorithm for determining when electrical circuit poles and zeros (i.e., roots) are topologically localized to a node or coupled-pair of nodes is described. Discovering this relationship provides insight to designers for circuit optimization, and is a basis upon which nonlinear dynamic behavioral models can be built. This root localization algorithm, the main contribution of this paper, facilitates the creation of models that more accurately reflect the distinctive behavior of a circuit. This is accomplished by identifying when poles and zeros can be modeled as localized effects whose values change with circuit operating conditions. The underlying modeling approach is described to provide a context for this research. The algorithm is illustrated through several examples.

High-Temperature Silicon-on-Insulator Gate Driver for SiC-FET Power Modules

Silicon Carbide (SiC) power semiconductors have shown the capability of greatly outperforming Si-based power devices. Faster switching and smaller on-state losses coupled with higher voltage blocking and temperature capabilities make SiC an attractive semiconductor for high-performance, high-power-density power modules. However, the temperature capabilities and increased power density are fully realized only when the gate driver needed to control the SiC devices is placed next to them. This requires the gate driver to successfully operate under extreme conditions with reduced or no heat sinking requirements. In addition, since SiC devices are usually connected in a half- or full-bridge configuration, the gate driver should provide electrical isolation between the high- and low-voltage sections of the driver itself. This paper presents a 225°C operable, silicon-on-insulator (SOI) high-voltage isolated gate driver IC for SiC devices. The IC was designed and fabricated in a 1 μm, partially depleted, CMOS process. The presented gate driver consists of a primary and a secondary side which are electrically isolated by the use of a transformer. The gate driver IC has been tested at a switching frequency of 200 kHz at 225°C while exhibiting a dv/dt noise immunity of at least 45 kV/μs.

A 55 kW three-phase inverter with Si IGBTs and SiC Schottky diodes

Silicon carbide (SiC) power devices are expected to have an impact on power converter efficiency, weight, volume, and reliability. Presently, only SiC Schottky diodes are commercially available at relatively low current ratings. Oak Ridge National Laboratory has collaborated with Cree and Semikron to build a Si IGBT-SiC Schottky diode hybrid 55kW inverter by replacing the Si pn diodes in Semikrons automotive inverter with Crees made-to-order higher current SiC Schottky diodes. This paper presents the developed models of these diodes for circuit simulators, shows inverter test results, and compares the results to those of a similar all-Si inverter.

Power Conversion with SiC Devices at Extremely High Ambient Temperatures

This paper evaluates the capability of SiC devices for operation under extremely high ambient temperatures. To this end, the authors packaged SiC JFET and Schottky barrier diodes (SBD) in thermally stable packages and built a high-temperature inductor to be evaluated in a DC-DC buck converter. The DC characteristics of the SiC JFET devices were first measured at ambient temperatures ranging from room temperature up to 450 degC. The experimental results show that the device can operate at 450 degC, which is impossible for conventional Si devices, but as expected the current capability of the SiC JFET diminishes with rising temperatures. A DC-DC converter was then designed and built in accordance with the static characteristics of the SiC JFETs that were measured under extremely high ambient temperatures. The converter was tested up to an ambient temperature of 400 degC. The conduction loss of the SiC JFET increases slightly, as predicted from its DC characteristics, but its switching characteristics hardly change with increasing temperatures. Thus, SiC devices are well suited for operation in harsh temperature environments