H. Peter W. Hey

Method for in-situ cleaning of native oxide from silicon surfaces

Semiconductor wafer process chamber with susceptor back coating

Low temperature etching in cold-wall CVD systems

Dynamic pulse plating for high aspect ratio features

Silicon nitride deposition

Flow diffuser to be used in electro-chemical plating system

Segmenting of processing system into wet and dry areas

Interconnect line formed by dual damascene using dielectric layers having dissimilar etching characteristics

Reverse voltage bias for electro-chemical plating system and method

Flow diffuser to be used in electro-chemical plating system and method