Kyung-Lae Jang

Package circuit board and package including a package circuit board and method thereof

Semiconductor package having a first conductive bump and a second conductive bump and methods for manufacturing the same

Semiconductor package with conductive molding compound and manufacturing method thereof

Semiconductor package on package having plug-socket type wire connection between packages

Printed circuit board having shield structure of signal transmission line

Printed circuit board having a bond wire shield structure for a signal transmission line

Package circuit board with a reduced number of pins and package including a package circuit board with a reduced number of pins and methods of manufacturing the same

Semiconductor device package connecting system, has two sets of bonding regions positioned along two guide lines and correspond to two sets of adjacent bonding pads at central region of die, respectively

Packungsleiterplatte, Herstellungs- und Spannungsbereitstellungsverfahren Pack PCB, manufacturing and voltage provisioning procedures

Pack circuit board manufacturing and power delivery methods