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Kyung-Lae Jang

Samsung

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Publication

Featured researches published by Kyung-Lae Jang.

Archive | 2005

Package circuit board and package including a package circuit board and method thereof

Kyung-Lae Jang; Hee-Seok Lee

Archive | 2005

Semiconductor package having a first conductive bump and a second conductive bump and methods for manufacturing the same

Heung-Kyu Kwon; Kyung-Lae Jang; Hee-Seok Lee

Archive | 2005

Semiconductor package with conductive molding compound and manufacturing method thereof

Byeong-Yeon Cho; Hee-Seok Lee; Kyung-Lae Jang

Archive | 2007

Semiconductor package on package having plug-socket type wire connection between packages

Kyung-Lae Jang; Kwon-Young Roh

Archive | 2005

Printed circuit board having shield structure of signal transmission line

Hee-Seok Lee; Kyung-Lae Jang; Tae-Je Cho; Kiwon Choi

Archive | 2005

Printed circuit board having a bond wire shield structure for a signal transmission line

Hee-Seok Lee; Kyung-Lae Jang; Tae-Je Cho; Kiwon Choi

Archive | 2005

Package circuit board with a reduced number of pins and package including a package circuit board with a reduced number of pins and methods of manufacturing the same

Kyung-Lae Jang; Hee-Seok Lee

Archive | 2006

Semiconductor device package connecting system, has two sets of bonding regions positioned along two guide lines and correspond to two sets of adjacent bonding pads at central region of die, respectively

Kyung-Lae Jang; Hee-Seok Lee; Heung-Kyu Kwon

Archive | 2005

Packungsleiterplatte, Herstellungs- und Spannungsbereitstellungsverfahren Pack PCB, manufacturing and voltage provisioning procedures

Kyung-Lae Jang; Hee-Seok Lee

Archive | 2005

Pack circuit board manufacturing and power delivery methods

Kyung-Lae Jang; Hee-Seok Lee

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Collaboration

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Hee-Seok Lee

Samsung

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Heung-Kyu Kwon

Samsung

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Kiwon Choi

Samsung

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Tae-Je Cho

Samsung

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Byeong-Yeon Cho

Samsung

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Kwon-Young Roh

Samsung

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