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Latest external collaboration on country level. Dive into details by clicking on the dots.

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Dive into the research topics where Dong-Hyeon Jang is active.

Publication


Featured researches published by Dong-Hyeon Jang.


Archive | 2004

Chip stack package and manufacturing method thereof

Kang-Wook Lee; Gu-Sung Kim; Dong-Hyeon Jang; Seung-Duk Baek; Jae-Sik Chung


Archive | 2005

Electrode structure of a semiconductor device and method of manufacturing the same

Hyun-Soo Chung; Sung-min Sim; Myeong-Soon Park; Dong-Hyeon Jang; Young-hee Song


Archive | 2008

Semiconductor packages with enhanced joint reliability and methods of fabricating the same

Hyun-Soo Chung; Dong-Hyeon Jang; Nam-Seog Kim; Sun-Won Kang


Archive | 2002

Wafer level package and method for manufacturing the same

Gu-Sung Kim; Dong-Hyeon Jang; Min-Young Son; Sa-Yoon Kang


Archive | 2005

Image sensor device and method of manufacturing same

Yong-Chai Kwon; Kang-Wook Lee; Gu-Sung Kim; Seong-Il Han; Keum-Hee Ma; Suk-Chae Kang; Dong-Hyeon Jang


Archive | 2005

Semiconductor package having protective layer for re-routing lines and method of manufacturing the same

Jae-Sik Chung; Se-young Jeong; Dong-Hyeon Jang


Archive | 2014

3d semiconductor device

Uk-Song Kang; Dong-Hyeon Jang; Seong-Jin Jang; Hoon Lee; Jin-Ho Kim; Nam-Seog Kim; Byung-sik Moon; Woo-dong Lee


Archive | 2011

Semiconductor device, fabricating method thereof and semiconductor package including the semiconductor device

Ho-Jin Lee; Tae-Je Cho; Dong-Hyeon Jang; Ho-geon Song; Se-young Jeong; Un-Byoung Kang; Min-Seung Yoon


Archive | 2007

Wafer level chip scale package having a gap and method for manufacturing the same

Myeong-Soon Park; Hyun-Soo Chung; In-Young Lee; Jae-Sik Chung; Sung-min Sim; Dong-Hyeon Jang; Young-hee Song; Seung-Kwan Ryu


Archive | 2005

Methods of fabricating integrated circuit chips for multi-chip packaging and wafers and chips formed thereby

In-Young Lee; Sung-min Sim; Dong-Hyeon Jang; Hyun-Soo Chung; Young-hee Song; Myeong-Soon Park

Collaboration


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