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Ratibor Radojcic

Qualcomm

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Publication

Featured researches published by Ratibor Radojcic.

Archive | 2009

Variable Feature Interface That Induces A Balanced Stress To Prevent Thin Die Warpage

Arvind Chandrasekaran; Ratibor Radojcic

Archive | 2015

BOTTOM PACKAGE WITH METAL POST INTERCONNECTIONS

Shiqun Gu; Ratibor Radojcic; Dong Wook Kim

Archive | 2015

INTEGRATED DEVICE COMPRISING HIGH DENSITY INTERCONNECTS IN INORGANIC LAYERS AND REDISTRIBUTION LAYERS IN ORGANIC LAYERS

Shiqun Gu; Ratibor Radojcic; Dong Wook Kim; Jae Sik Lee

Archive | 2014

DUAL SUBSTRATE, POWER DISTRIBUTION AND THERMAL SOLUTION FOR DIRECT STACKED INTEGRATED DEVICES

Brian Matthew Henderson; Durodami J. Lisk; Shiqun Gu; Ratibor Radojcic; Matthew Michael Nowak

Archive | 2009

Hybrid package construction with wire bond and through silicon vias

Ratibor Radojcic; Arvind Chandrasekaran; Ryan David Lane

Archive | 2015

Integrated device comprising a substrate with aligning trench and/or cooling cavity

Shiqun Gu; Ratibor Radojcic; Dong Wook Kim

Archive | 2013

ENHANCED PACKAGE THERMAL MANAGEMENT USING EXTERNAL AND INTERNAL CAPACITIVE THERMAL MATERIAL

Victor Adrian Chiriac; Durodami J. Lisk; Ratibor Radojcic

Archive | 2011

Voltage switchable dielectric for die-level electrostatic discharge (ESD) protection

Shiqun Gu; Ratibor Radojcic; Yiming Li

Archive | 2017

Integrated device comprising a capacitor that includes multiple pins and at least one pin that traverses a plate of the capacitor

Shiqun Gu; Shree Krishna Pandey; Ratibor Radojcic

Archive | 2014

LOW COST INTERPOSER COMPRISING AN OXIDATION LAYER

Shiqun Gu; Urmi Ray; Roawen Chen; Brian Matthew Henderson; Ratibor Radojcic; Matthew Michael Nowak; Nicholas K. Yu

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Collaboration

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Shiqun Gu

Qualcomm

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Dong Wook Kim

Qualcomm

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Arvind Chandrasekaran

Qualcomm

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Durodami J. Lisk

Qualcomm

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Jae Sik Lee

Qualcomm

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Brian Matthew Henderson

Qualcomm

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Matthew Michael Nowak

Qualcomm

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Urmi Ray

Qualcomm

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Victor Adrian Chiriac

Qualcomm

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Eugene R. Worley

Qualcomm

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