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Dive into the research topics where Iris Xu is active.

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Featured researches published by Iris Xu.


Journal of microelectronics and electronic packaging | 2017

Fan-Out Wafer-Level Packaging (FOWLP) of Large Chip with Multiple Redistribution Layers (RDLs)

John H. Lau; Ming Li; Nelson Fan; Eric Kuah; Zhang Li; Kim Hwee Tan; Tony Chen; Iris Xu; Margie Li; Yiu Ming Cheung; Wu Kai; Ji Hao; Rozalia Beica; Tom Taylor; Cheng-Ta Ko; Henry Yang; Yu-Ting Chen; Sze Pei Lim; Nc Lee; Jiang Ran; Koh Sau Wee; Qingxiang Yong; Cao Xi; Mian Tao; Jeffery C. C. Lo; Ricky Shi Wei Lee


International Symposium on Microelectronics | 2017

Characterizations of Fan-out Wafer-Level Packaging

Ming Li; Qingqian Li; John H. Lau; Nelson Fan; Eric Kuah; Wu Kai; Ken Cheung; Zhang Li; Kim Hwee Tan; Iris Xu; Dong Chen; Rozalia Beica; Cheng-Ta Ko; Henry Yang; Sze Pei Lim; Jiang Ran; Cao Xi


IEEE Transactions on Components, Packaging and Manufacturing Technology | 2018

Chip-First Fan-Out Panel-Level Packaging for Heterogeneous Integration

Cheng-Ta Ko; Henry Yang; John H. Lau; Ming Li; Margie Li; Curry Lin; Jw Lin; Tony Chen; Iris Xu; Chieh-Lin Chang; Jhih-Yuan Pan; Hsing-Hui Wu; Qing Xiang Yong; Nelson Fan; Eric Kuah; Zhang Li; Kim Hwee Tan; Yiu Ming Cheung; Eric Ng; Wu Kai; Ji Hao; Rozalia Beica; Marc Lin; Yu-Hua Chen; Zhong Cheng; Koh Sau Wee; Jiang Ran; Cao Xi; Sze Pei Lim; Nc Lee


electronic components and technology conference | 2018

Warpage Measurements and Characterizations of Fan-Out Wafer-Level Packaging with Large Chips and Multiple Redistributed Layers

John H. Lau; Ming Li; Yang Lei; Margie Li; Iris Xu; Tony Chen; Sandy Chen; Qing Xiang Yong; Kumar Janardhanan; Wu Kai; Nelson Fan; Eric Kuah; Zhang Li; Kim Hwee Tan; Winsons Bao; Sze Pei Lim; Rozalia Beica; Cheng-Ta Ko; Cao Xi


electronic components and technology conference | 2018

Reliability of Fan-Out Wafer-Level Packaging with Large Chips and Multiple Re-Distributed Layers

John H. Lau; Ming Li; Lei Yang; Margie Li; Qing Xiang Yong; Zhong Cheng; Tony Chen; Iris Xu; Nelson Fan; Eric Kuah; Zhang Li; Kim Hwee Tan; Yiu Ming Cheung; Eric Ng; Penny Lo; Wu Kai; Ji Hao; Rozalia Beica; Koh Sau Wee; Jiang Ran; Cao Xi; Sze Pei Lim; Nc Lee; Cheng-Ta Ko; Henry Yang; Yh Chen; Mian Tao; Jeffery C. C. Lo; Ricky Shi Wei Lee


IEEE Transactions on Components, Packaging and Manufacturing Technology | 2018

Warpage Measurements and Characterizations of Fan-Out Wafer-Level Packaging With Large Chips and Multiple Redistributed Layers

John H. Lau; Ming Li; Lei Yang; Margie Li; Iris Xu; Tony Chen; Sandy Chen; Qing Xiang Yong; Janardhanan Pillai Madhukumar; Wu Kai; Nelson Fan; Eric Kuah; Zhang Li; Kim Hwee Tan; Winsons Bao; Sze Pei Lim; Rozalia Beica; Cheng-Ta Ko; Cao Xi


IEEE Transactions on Components, Packaging and Manufacturing Technology | 2018

Fan-Out Wafer-Level Packaging for Heterogeneous Integration

John H. Lau; Ming Li; Margie Li Qingqian; Tony Chen; Iris Xu; Qing Xiang Yong; Zhong Cheng; Nelson Fan; Eric Kuah; Zhang Li; Kim Hwee Tan; Yiu Ming Cheung; Eric Ng; Penny Lo; Wu Kai; Ji Hao; Koh Sau Wee; Jiang Ran; Cao Xi; Rozalia Beica; Sze Pei Lim; Nc Lee; Cheng-Ta Ko; Henry Yang; Yu-Hua Chen; Mian Tao; Jeffery C. C. Lo; Ricky Shi Wei Lee


IEEE Transactions on Components, Packaging and Manufacturing Technology | 2018

Design, Materials, Process, Fabrication, and Reliability of Fan-Out Wafer-Level Packaging

John H. Lau; Ming Li; Qingqian Margie Li; Iris Xu; Tony Chen; Zhang Li; Kim Hwee Tan; Qing Xiang Yong; Zhong Cheng; Koh Sau Wee; Rozalia Beica; Cheng-Ta Ko; Sze Pei Lim; Nelson Fan; Eric Kuah; Wu Kai; Yiu Ming Cheung; Eric Ng; Cao Xi; Jiang Ran; Henry Yang; Yh Chen; Nc Lee; Mian Tao; Jeffery C. C. Lo; Ricky Shi Wei Lee


International Symposium on Microelectronics | 2017

Fan-Out Wafer-Level Packaging (FOWLP) of Large Chip with Multiple Redistribution-Layers (RDLs)

John H. Lau; Ming Li; Nelson Fan; Eric Kuah; Zhang Li; Kim Hwee Tan; Tony Chen; Iris Xu; Margie Li; Yiu Ming Cheung; Wu Kai; Ji Hao; Rozalia Beica; Tom Taylor; Cheng-Ta Ko; Henry Yang; Yh Chen; Sze Pei Lim; Nc Lee; Jiang Ran; Koh Sau Wee; Qingxiang Yong; Cao Xi; Mian Tao; Jeffery Lo; Ricky Lee

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Cheng-Ta Ko

Industrial Technology Research Institute

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