David R. Hembree

Multi-dice chip scale semiconductor components and wafer level methods of fabrication

Carrier for testing an unpackaged semiconductor die

Micromachined chip scale package

Method for fabricating semiconductor components and interconnects with contacts on opposing sides

Semiconductor probe card having resistance measuring circuitry and method fabrication

Circuit and method for heating an adhesive to package or rework a semiconductor die

Through-wafer interconnects for photoimager and memory wafers

Method and apparatus for testing unpackaged semiconductor dice

Test system with mechanical alignment for semiconductor chip scale packages and dice

Testing apparatus having substrate interconnect for discrete die burn-in for nonpackaged die