Derek Gochnour

Carrier and system for testing bumped semiconductor components

Interconnect having recessed contact members with penetrating blades for testing semiconductor dice and packages with contact bumps

Flexible semiconductor interconnect fabricated by backside thinning

Semiconductor package with wire bond protective member

Method for sawing wafers employing multiple indexing techniques for multiple die dimensions

Method for using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's will undergo, such as additional repairs

Semiconductor package with pre-fabricated cover and method of fabrication

Method for forming an interconnect for testing unpackaged semiconductor dice

Method for testing semiconductor components

System for testing semiconductor components having flexible interconnect