Jerrold L. King

Semiconductor chip package

Method for producing high speed integrated circuits

Low profile multi-IC chip package connector

Method for attaching a semiconductor die to a leadframe using a patterned adhesive layer

Integrated circuit package alignment feature

Integrated circuit package including lead frame with electrically isolated alignment feature

Semiconductor device manufactured by a method for attaching a semiconductor die to a leadframe using a thermoplastic covered carrier tape

Semiconductor assembly utilizing elastomeric single axis conductive interconnect

Plastic lead frames for semiconductor devices, packages including same, and methods of fabrication

Multichip semiconductor package