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Dive into the research topics where Jinhyun Shin is active.

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Featured researches published by Jinhyun Shin.


international electron devices meeting | 2002

A 2 Gb NAND flash memory with 0.044 /spl mu/m/sup 2/ cell size using 90 nm flash technology

Dong-Chan Kim; Wang-Chul Shin; Jae-Duk Lee; Jinhyun Shin; Joon-hee Lee; Sung-Hoi Hur; Ihn-gee Baik; Yoo-Choel Shin; Chang-Hyun Lee; Jae-Sun Yoon; Heon-Guk Lee; Kwon-Soon Jo; Seungwook Choi; Byung-Kwan You; Jeong-Hyuk Choi; Donggun Park; Kinam Kim

A manufacturable 2 Gb NAND flash memory with 0.044 /spl mu/m/sup 2/ cell size, which is the smallest cell size ever reported in semiconductor memory, is successfully developed with 90 nm NAND flash technology for high density file storage application. The three main key technology features of 90 nm NAND flash technology are advanced KrF lithography with off-axis illumination system equipped with a dipole aperture, reduced stack height of cell, and optimized gate reoxidation affecting tunnel oxide profile.


international electron devices meeting | 2010

A highly manufacturable integration technology for 27nm 2 and 3bit/cell NAND flash memory

Choong-ho Lee; Suk-kang Sung; Dong-Hoon Jang; Se-Hoon Lee; Seungwook Choi; Jong-Hyuk Kim; Se-Jun Park; Min-Sung Song; Hyun-Chul Baek; Eungjin Ahn; Jinhyun Shin; Kwang-Shik Shin; Kyunghoon Min; Sung-Soon Cho; Chang-Jin Kang; Jung-Dal Choi; Keon-Soo Kim; Jeong-Hyuk Choi; Kang-Deog Suh; Tae-Sung Jung

A highly manufacturable multi-level NAND flash memory with a 27nm design rule has been successfully developed for the first time. Its unit cell size is 0.00375um2 (with overhead). Self Aligned Reverse Patterning is used to improve initial Vth distribution induced from DPT (Double Patterning Technology) process. By using advanced channel doping technique, the channel junction leakage is minimized and the Vpass window is improved. The optimized doping structure and cell operation scheme are evaluated. And finally 2 and 3bit per cell operation are successfully demonstrated with flash cells of 32Gb density with reasonable reliability.


Archive | 2015

Semiconductor memory devices and methods of fabricating the same

Jae-Hwang Sim; Jinhyun Shin; Jong-Min Lee


Archive | 2003

Flash memory devices having a sloped trench isolation structure and methods of fabricating the same

Jeong-Hyuk Choi; Wang-Chul Shin; Jinhyun Shin


Archive | 2005

Methods of fabricating flash memory devices having a sloped trench isolation structure

Jeong-Hyuk Choi; Wang-Chul Shin; Jinhyun Shin


Archive | 2003

Flash memory devices having a sloped trench isolation structure

Jeong-Hyuk Choi; Wang-Chul Shin; Jinhyun Shin


Archive | 2003

Methods of forming trench isolated integrated circuit devices including grooves

Jae-sun Yun; Jinhyun Shin


Archive | 2010

Semiconductor device including resistor and method of fabricating the same

Yoon-Moon Park; Keon-Soo Kim; Jinhyun Shin; Jae-Hwang Sim


Archive | 2006

Non-volatile memory devices having floating gates and related methods of forming the same

Joon-hee Lee; Jong-Ho Park; Jinhyun Shin; Sung-Hoi Hur; Yong-Seok Kim; Jong Won Kim


Archive | 2003

Methods of forming gate structures in nonvolatile memory devices having curved side walls formed using oxygen pathways

Jae-sun Yun; Jinhyun Shin

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