Joerg Hohage

Barrier layer for a copper metallization layer including a low k dielectric

Nitrogen-enriched low-k barrier layer for a copper metallization layer

Method of forming a cap layer having anti-reflective characteristics on top of a low-k dielectric

Method of removing oxidized portions at an interface of a metal surface and capping layer in a semiconductor metallization layer

NON-INSULATING STRESSED MATERIAL LAYERS IN A CONTACT LEVEL OF SEMICONDUCTOR DEVICES

Highly efficient remote clean process for process chambers in deposition tools

Reduced wafer warpage in semiconductors by stress engineering in the metallization system

TECHNIQUE FOR FORMING A SILICON NITRIDE LAYER HAVING HIGH INTRINSIC COMPRESSIVE STRESS

Übertragung von kompressiver Verspannung in einem Zwischenschichtdielektrikum einer Halbleitervorrichtung durch Bereitstellen einer Zweischicht mit verbesserter Haftung und innerer Verspannung

COMPRESSIVE STRESS TRANSFER IN AN INTERLAYER DIELECTRIC OF A SEMICONDUCTOR DEVICE BY PROVIDING A BI-LAYER OF SUPERIOR ADHESION AND INTERNAL STRESS