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John A. Fitzsimmons

IBM

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Featured researches published by John A. Fitzsimmons.

MRS Online Proceedings Library Archive | 2002

Evaluation of the Chemical-mechanical Planarization (CMP) Performance of Silicon Nitride and Silicon Carbide as Hard Mask Materials for Cu-based Interconnect Technology

Wei-Tsu Tseng; Jia Lee; John A. Fitzsimmons; Glenn A. Biery; Edward Paul Barth; Ronald Goldblatt

Hydrogenated silicon nitride, hydrogenated silicon carbide, and their intermediates were chemo-mechanically polished. Results showed that, within the material set examined, harder materials also have higher CMP removal rates. In addition, CMP rates for multilayer stacks did not follow those for single layers. Polish mechanisms were proposed to explain these phenomena.

Archive | 1991

Method for forming patterned films on a substrate

John A. Fitzsimmons; Janos Havas; Margaret Jane Lawson; Edward Joseph Leonard; Bryan Rhoads

Archive | 2005

Exposed pore sealing post patterning

Edward C. Cooney; John A. Fitzsimmons; Jeffrey P. Gambino; Stephen E. Luce; Thomas L. McDevitt; Lee M. Nicholson; Anthony K. Stamper

Archive | 2007

Device and methodology for reducing effective dielectric constant in semiconductor devices

Daniel C. Edelstein; Matthew E. Colburn; Edward C. Cooney; Timothy J. Dalton; John A. Fitzsimmons; Jeffrey P. Gambino; Elbert E. Huang; Michael Lane; Vincent J. McGahay; Lee M. Nicholson; Satyanarayana V. Nitta; Sampath Purushothaman; Sujatha Sankaran; Thomas M. Shaw; Andrew H. Simon; Anthony K. Stamper

Archive | 2002

Advanced BEOL interconnect structures with low-k PE CVD cap layer and method thereof

Edward Paul Barth; John A. Fitzsimmons; Stephen M. Gates; Thomas H. Ivers; Sarah L. Lane; Jia Lee; Ann McDonald; Vincent J. McGahay; Darryl D. Restaino

Archive | 2003

Bilayer HDP CVD / PE CVD cap in advanced BEOL interconnect structures and method thereof

Tze-Chiang Chen; Brett H. Engel; John A. Fitzsimmons; Terence Kane; Naftall E. Lustig; Ann McDonald; Vincent J. McGahay; Soon-Cheon Seo; Anthony K. Stamper; Yun Yu Wang; Erdem Kaltalioglu

Archive | 2004

Reliable low-k interconnect structure with hybrid dielectric

John A. Fitzsimmons; Stephen E. Greco; Jia Lee; Stephen M. Gates; Terry A. Spooner; Matthew Angyal; Habib Hichri; Theordorus Standaert; Glenn A. Biery

Archive | 1993

Structure and fabrication of SiCr microfuses

Roy A. Carruthers; Fernand Dorleans; John A. Fitzsimmons; Richard Flitsch; James A. Jubinsky; Gerald R. Larsen; Geraldine Cogin Schwartz; Paul J. Tsang; Robert W. Zielinski

Archive | 2003

Damascene interconnect structures including etchback for low-k dielectric materials

Anthony K. Stamper; Edward C. Cooney; Jeffrey P. Gambino; Timothy J. Dalton; John A. Fitzsimmons; Lee M. Nicholson

Archive | 2001

Method for cleaning and preconditioning a chemical vapor deposition chamber dome

John A. Fitzsimmons; Thomas H. Ivers; Pavel Smetana

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Anthony K. Stamper

IBM

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Mukta G. Farooq

IBM

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Jeffrey P. Gambino

IBM

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Stephen M. Gates

IBM

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Lee M. Nicholson

IBM

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Timothy J. Dalton

IBM

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Vincent J. McGahay

IBM

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Daniel C. Edelstein

IBM

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Erdem Kaltalioglu

IBM

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Naftali E. Lustig

IBM

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