John Armer

Diode-triggered SCR (DTSCR) for RF-ESD protection of BiCMOS SiGe HBTs and CMOS ultra-thin gate oxides

A novel diode-triggered SCR (DTSCR) ESD protection element is introduced for low-voltage application (signal, supply voltage /spl les/1.8 V) and extremely narrow ESD design margins. Trigger voltage engineering in conjunction with fast and efficient SCR voltage clamping is applied for the protection of ultra-sensitive circuit nodes, such as SiGe HBT bases (e.g. f/sub Tmax/=45 GHz in BiCMOS-0.35 /spl mu/m LNA input) and thin gate-oxides (e.g. tox=1.7 nm in CMOS-0.09 /spl mu/m input). SCR integration is possible based on CMOS devices or can alternatively be formed by high-speed SiGe HBTs.

High holding current SCRs (HHI-SCR) for ESD protection and latch-up immune IC operation ☆

This paper presents a novel SCR for power line and local I/O ESD protection. The HHI-SCR exhibits a dual ESD clamp characteristic: low-current high-voltage clamping and high-current low-voltage clamping. These operation modes enable latch-up immune normal operation as well as superior full chip ESD protection. The minimum latch current is controlled by device design. The HHI-SCR is demonstrated in 0.10um-CMOS and in a 0.4um-BiCMOS technology. The design is highly area efficient.

Active-source-pump (ASP) technique for ESD design window expansion and ultra-thin gate oxide protection in sub-90nm technologies

This paper presents a novel active-source-pump (ASP) circuit technique to significantly lower the ESD sensitivity of ultrathin gate inputs in advanced sub-90nm CMOS technologies. As demonstrated by detailed experimental analysis, an ESD design window expansion of more than 100% can be achieved. This revives conventional ESD solutions for ultrasensitive input protection also enabling low-capacitance RF protection schemes with a high ESD design flexibility at IC-level. ASP IC application examples, and the impact of ASP on normal RF operation performance, are discussed.

ESD protection circuit design for ultra-sensitive IO applications in advanced sub-90nm CMOS technologies

This paper presents a protection strategy for ultra-sensitive I/O containing thin gate oxides, while combining two complementary ESD design approaches: (1) low-voltage diode-chain triggered SCR clamps that allow for efficient voltage clamping; (2) active-source-pump circuits applied for effective expansion of narrow ESD design windows for ultra-thin GOX protection. The focus of the paper is on the ASP schemes while some RF aspects are covered as well.

Multi-finger turn-on circuits and design techniques for enhanced ESD performance and width scaling

A silicon-proven multi-finger turn-on (MFT) design technique that enables ESD width scaling combined with very low dynamic on-resistance is presented in various implementations. It can be applied to (self-protecting) drivers and/or ESD protection design. Using a novel merged ballast circuit design, very compact ESD protection configurations with an ESD area performance up to 5VHBM/um2 can be realized both in fully silicided and silicide blocked NMOS designs.

Novel design of driver and ESD transistors with significantly reduced silicon area

Abstract This paper presents three novel design techniques, which combined fulfill all major requirements posed on large driver and electrostatic discharge (ESD) protection transistors: minimum area consumption, good ESD robustness and optimized normal operation. Transistors protecting 5 V/μm 2 human body model were demonstrated. Significant silicon area reduction was demonstrated in deep-sub-micron CMOS, ranging from 0.35 μm down to 0.13 μm CMOS. This novel design solution follows standard design flows and does not require any process modifications.