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John P. McCormick

LSI Corporation

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Publication

Featured researches published by John P. McCormick.

Archive | 2000

Vertically integrated flip chip semiconductor package

John P. McCormick

Archive | 1997

Integrated heat spreader/stiffener with apertures for semiconductor package

John P. McCormick; Sunil A. Patel

Archive | 1997

Die clip assembly for semiconductor package

Kishor V. Desai; Sunil A. Patel; John P. McCormick

Archive | 1996

Electronic system using multi-layer tab tape semiconductor device having distinct signal, power and ground planes

Michael D. Rostoker; Kurt Raymond Raab; John P. McCormick

Archive | 1992

Power plane for semiconductor device

Jon Long; John P. McCormick

Archive | 2001

Chip-over-chip integrated circuit package

John P. McCormick

Archive | 1996

Multi-layer tape having distinct signal, power and ground planes, semiconductor device assembly employing same, apparatus for and method of assembling same

Brian Lynch; John P. McCormick

Archive | 1996

Semiconductor device assembly including power or ground plane which is provided on opposite surface of insulating layer from signal traces, and is exposed to central opening in insulating layer for interconnection to semiconductor die

John P. McCormick

Archive | 1993

Location and standoff pins for chip on tape

Emily Hawthorne; John P. McCormick

Archive | 2001

Dual-thickness solder mask in integrated circuit package

John P. McCormick

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Kishor V. Desai

LSI Corporation

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Brian Lynch

LSI Corporation

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Emily Hawthorne

LSI Corporation

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Sunil A. Patel

LSI Corporation

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Kurt Raymond Raab

LSI Corporation

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Maniam Alagaratnam

LSI Corporation

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Ivor G. Barber

LSI Corporation

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Jon Long

LSI Corporation

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Kumar Nagarajan

LSI Corporation

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Michael D. Rostoker

LSI Corporation

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