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Maniam Alagaratnam

LSI Corporation

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Publication

Featured researches published by Maniam Alagaratnam.

Archive | 1996

Stacked integrated chip package and method of making same

Maniam Alagaratnam; Qwai H. Low; Chok J. Chia

Archive | 1997

Molded laminate package with integral mold gate

Qwai H. Low; Manickam Thavarajah; Chok J. Chia; Maniam Alagaratnam

Archive | 1997

System and method for packaging an integrated circuit using encapsulant injection

Chok J. Chia; Seng Sooi Lim; Maniam Alagaratnam

Archive | 1997

Grooved semiconductor die for flip-chip heat sink attachment

Chok J. Chia; Seng-Sooi Lim; Maniam Alagaratnam

Archive | 2000

Interposer for semiconductor package assembly

Maniam Alagaratnam; Kishor V. Desai; Sunil A. Patel

Archive | 2002

Integrated circuit package substrate with high density routing mechanism

Wee K. Liew; Aritharan Thurairajaratnam; Maniam Alagaratnam

Archive | 1997

Semiconductor die having sacrificial bond pads for die test

Chok J. Chia; Qwai H. Low; Maniam Alagaratnam

Archive | 2004

Method and apparatus for establishing improved thermal communication between a die and a heatspreader in a semiconductor package

Kishor V. Desai; Maniam Alagaratnam

Archive | 1995

Method of improving molding of an overmolded package body on a substrate

Chok J. Chia; Seng-Sooi Lim; Maniam Alagaratnam

Archive | 1997

Ball grid array package employing raised metal contact rings

Chok J. Chia; Qwai H. Low; Maniam Alagaratnam

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Chok J. Chia

LSI Corporation

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Qwai H. Low

LSI Corporation

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Kishor V. Desai

LSI Corporation

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Patrick Variot

LSI Corporation

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John P. McCormick

LSI Corporation

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Seng-Sooi Lim

LSI Corporation

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Sarathy Rajagopalan

LSI Corporation

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Sunil A. Patel

LSI Corporation

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Aritharan Thurairajaratnam

LSI Corporation

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Manickam Thavarajah

LSI Corporation

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