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Sunil A. Patel

LSI Corporation

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Publication

Featured researches published by Sunil A. Patel.

Archive | 1997

Integrated heat spreader/stiffener with apertures for semiconductor package

John P. McCormick; Sunil A. Patel

Archive | 1997

Die clip assembly for semiconductor package

Kishor V. Desai; Sunil A. Patel; John P. McCormick

Archive | 2000

Interposer for semiconductor package assembly

Maniam Alagaratnam; Kishor V. Desai; Sunil A. Patel

Archive | 1996

Process for manufacturing a semiconductor device having a stiffener member

Seng-Sooi Lim; Ramaswamy Ranganathan; Sunil A. Patel

Archive | 1997

Vacuum assisted underfill process and apparatus for semiconductor package fabrication

Galen Kirkpatrick; Manickam Thavarajah; Sunil A. Patel; Stephen A. Murphy

Archive | 1997

Integrated heat spreader/stiffener assembly and method of assembly for semiconductor package

Kishor V. Desai; Sunil A. Patel; John P. McCormick

Archive | 1999

Apparatus and method for improving ball joints in semiconductor packages

Sunil A. Patel; Chok J. Chia; Kishor V. Desai

Archive | 2000

Non-isothermal electromigration testing of microelectronic packaging interconnects

Senol Pekin; Sunil A. Patel

Archive | 2001

Test fixture for flip chip ball grid array circuits

Kishor V. Desai; Maniam Alagaratnam; Sunil A. Patel

Archive | 1999

Semiconductor flip chip ball grid array package

Kishor V. Desai; Sunil A. Patel; Ramaswamy Ranganathan

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Kishor V. Desai

LSI Corporation

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John P. McCormick

LSI Corporation

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Ramaswamy Ranganathan

Avago Technologies

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Maniam Alagaratnam

LSI Corporation

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Seng-Sooi Lim

LSI Corporation

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Chok J. Chia

LSI Corporation

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Galen Kirkpatrick

LSI Corporation

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Manickam Thavarajah

LSI Corporation

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Senol Pekin

LSI Corporation

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Stephen A. Murphy

LSI Corporation

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