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Jung-Chih Tsao

TSMC

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Publication

Featured researches published by Jung-Chih Tsao.

Archive | 2006

Post ECP multi-step anneal/H2 treatment to reduce film impurity

Hsien-Ping Feng; Jung-Chih Tsao; Hsi-Kuei Cheng; Chih-Tsung Lee; Ming-Yuan Cheng; Steven Lin; Ray Chuang; Chi-Wen Liu

Archive | 2005

Via structure and process for forming the same

Jung-Chih Tsao; Kei-Wei Chen; Ying-Jing Lu; Yu-Sheng Wang; Yu-Ku Lin

Archive | 2004

Method and apparatus for copper film quality enhancement with two-step deposition

Chi-Wen Liu; Hsien-Ping Feng; Jung-Chih Tsao

Archive | 2004

Method of forming barrier layer with reduced resistivity and improved reliability in copper damascene process

Kei-Wei Chen; Jung-Chih Tsao; Chi-Wen Liu; Jchung-Chang Chen; Shih-Tzung Chang; Shih-Ho Lin; Yu-Ku Lin; Ying-Lang Wang

Archive | 2003

Novel method to reduce Rs pattern dependence effect

Jung-Chih Tsao; Chi-Wen Li; Kei-Wei Chen; Jye-Wei Hsu; Hsien-Pin Fong; Steven Lin; Ray Chuang

Archive | 2007

Via/contact and damascene structures and manufacturing methods thereof

Shih-Chieh Chang; Ying-Lang Wang; Kei-Wei Chen; Jung-Chih Tsao; Yu-Sheng Wang

Archive | 2006

Barrier layer for semiconductor interconnect structure

Yu-Sheng Wang; Jung-Chih Tsao; Kei-Wei Chen; Shih-Chieh Chang; Ying-Lang Wang

Archive | 2003

Method of reducing the pattern effect in the CMP process

Chi-Wen Liu; Jung-Chih Tsao; Shien-Ping Feng; Kei-Wei Chen; Shih-Chi Lin; Ray Chuang

Archive | 2014

Block layer in the metal gate of mos devices

Jung-Chih Tsao; Chi-Cheng Hung; Yu-Sheng Wang; Wen-Hsi Lee; Kei-Wei Chen; Ying-Lang Wang

Archive | 2012

VIA/CONTACT AND DAMASCENE STRUCTURES

Shih-Chieh Chang; Ying-Lang Wang; Kei-Wei Chen; Jung-Chih Tsao; Yu-Sheng Wang

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Kei-Wei Chen

TSMC

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Chi-Wen Liu

TSMC

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Ray Chuang

TSMC

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Hsien-Ping Feng

TSMC

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Steven Lin

TSMC

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Ying-Lang Wang

TSMC

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Yu-Sheng Wang

TSMC

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Hsi-Kuei Cheng

TSMC

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Ming-Yuan Cheng

TSMC

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Shih-Chieh Chang

TSMC

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