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Dive into the research topics where Junji Kunisawa is active.

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Featured researches published by Junji Kunisawa.


international symposium on semiconductor manufacturing | 2000

A novel compact ECD tool for ULSI Cu metallization

Manabu Tsujimura; Koji Mishima; Junji Kunisawa; Natsuki Makino; Tetsuo Matsuda; Hisashi Kaneko; Katsuya Okumura

A novel compact ECD (Electro chemical Deposition) tool was designed and developed for Cu multi-level interconnection. The design enables the entire plating process (i.e., pre-processing, electro-chemical deposition, cleaning, and drying processed wafers) to be performed using a single module, by which means optimum Raw Process Time, good uptime and low COO can be achieved The merit of the unique design using a porous ceramic presented here are non-uniformity improvement, edge profile control, and black-film protection.


Archive | 2004

Plating method and plating apparatus

Koji Mishima; Hiroaki Inoue; Natsuki Makino; Junji Kunisawa; Kenji Nakamura; Tetsuo Matsuda; Hisashi Kaneko; Toshiyuki Morita


Archive | 2001

Semiconductor substrate processing apparatus and method

Norio Kimura; Koji Mishima; Junji Kunisawa; Mitsuko Odagaki; Natsuki Makino; Manabu Tsujimura; Hiroaki Inoue; Kenji Nakamura; Moriji Matsumoto; Tetsuo Matsuda; Hisashi Kaneko; Toshiyuki Morita; Nobuo Hayasaka; Katsuya Okumura


Archive | 2001

Substrate processing apparatus and substrate plating apparatus

Koji Mishima; Junji Kunisawa; Natsuki Makino; Norio Kimura; Hiroaki Inoue; Kenji Nakamura; Moriji Matsumoto; Takahiro Nanjo; Mitsuko Odagaki


Archive | 2000

Plating apparatus and plating method for substrate

Junji Kunisawa; Mitsuko Odagaki; Natsuki Makino; Koji Mishima; Kenji Nakamura; Hiroaki Inoue; Norio Kimura; Tetsuo Matsuda; Hisashi Kaneko; Nobuo Hayasaka; Katsuya Okumura; Manabu Tsujimura; Toshiyuki Morita


Archive | 2003

Holding unit, processing apparatus and holding method of substrates

Junji Kunisawa; Norio Kimura; Kenya Ito; Akira Fukunaga; Yuuki Inoue; Hiroshi Tomita; Soichi Nadahara; Motoyuki Sato


Archive | 2009

Substrate processing apparatus, substrate processing method, substrate holding mechanism, and substrate holding method

Mitsuru Miyazaki; Seiji Katsuoka; Naoki Matsuda; Junji Kunisawa; Kenichi Kobayashi; Hiroshi Sotozaki; Hiroyuki Shinozaki; Osamu Nabeya; Shinya Morisawa; Takahiro Ogawa; Natsuki Makino


Archive | 2007

Electroplating apparatus and electroplating method

Satoru Yamamoto; Keiichi Kurashina; Takashi Kawakami; Tsutomu Nakada; Hiroyuki Kanda; Junji Kunisawa; Kunihito Ide


Archive | 2009

Substrate polishing apparatus and method

Seiji Katsuoka; Masahiko Sekimoto; Junji Kunisawa; Mitsuru Miyazaki; Teruyuki Watanabe; Kenichi Kobayashi; Masayuki Kumekawa; Toshio Yokoyama


Archive | 2000

Apparatus for plating substrate, method for plating substrate, electrolytic processing method, and apparatus thereof

Junji Kunisawa; Mitsuko Odagaki; Natsuki Makino; Koji Mishima; Kenji Nakamura; Hiroaki Inoue; Norio Kimura; Tetsuo Matsuda; Hisashi Kaneko; Nobuo Hayasaka; Katsuya Okumura; Manabu Tsujimura; Toshiyuki Morita

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