Junko Yamanaka

Single-channel prototype of a CMOS SVD preamplifier for the B-factory experiment, BELLE

Abstract A single-channel CMOS preamplifier circuit was fabricated as a part of R&D efforts to design a 128-channel preamplifier chip for a silicon vertex detector of the BELLE collaboration. The prototype chip was evaluated in detail with special emphasis being placed on its analog circuit design and performance. An eight-stage digital/analog pipe-line, and a quadruple-correlated noise filter with a low-noise preamplifier circuit include key technologies for the design.

Charge-partitioning study of a wide-pitch silicon micro-strip detector with a 64-channel CMOS preamplifier array

Abstract The wider pitch readout operation of a 50 μm-pitch double-sided silicon micro-strip detector has been studied specifically concerning its ohmic side. Every second readout and ganged configuration was examined by employing a newly developed 64-channel preamplifier array. The observed charge responses for collimated IR light were compared with a numerical model.

Fabrication of a double-sided silicon microstrip detector with an ONO capacitor dielectric film

Double-sided silicon microstrip detectors (DSSDs) with integrated coupling capacitors formed by an oxide-nitride-oxide (ONO) dielectric film were fabricated using newly developed processing techniques. We report on the processing techniques and some characteristics of the detectors fabricated in the above process.

Characteristics of a ferroelectric liquid crystal spatial light modulator with a dielectric mirror

The continuous gray scale operating characteristics of a ferroelectric liquid crystal spatial light modulator (FLC-SLM) are described. Then an FLC-SLM having a dielectric mirror between an a-Si:H photoconductor and an FLC light modulatory material is presented, and its operating characteristics are reported. The FLC-SLM having a dielectric mirror allows for continuous gray scale applications. It exhibits a resolution of 80 to 100 lp/mm and a higher optical gain than the device without a dielectric mirror.

Optical pattern recognition with LAPS-SLM (I): light-addressed photoconductor and smectic C* liquid-crystal spatial light modulator

Using a hydrogenated amorphous silicon as a photoconductor, the relatively new class of a light addressed photoconductor and SmC* liquid crystal spatial light modulator named LAPS-SLM is presented. The operation and characteristics of LAPS-SLM without using a dielectric mirror is reported.

Study of common-mode noise of the SMA2SH - 64 A preamplifier array

Abstract Employing a 64-channel CMOS preamplifier array, SMA2SH - 64 A, we studied its signal-to-noise ratio. Single-channel noise was substantially contaminated with a base-line shift, which was common for all neighboring channels. Subtracting the common base-line shift, we found that the noise level decreased to be acceptable in terms of the design parameters as well as for practical use.

Simulation and first beam test of a single-sided two-dimensional detector using pMOS pixels

Abstract A strip-like two-dimensional readout single-sided detector using pMOS pixels is being developed at KEK, as part of the R&D for the BELLE experiment. It may be used in upgrades of the vertex detector. The pMOS pixel is composed of a double drain pMOS transistor, providing direct amplification on site, implanted in the n-well collecting electrode of the detecting silicon pin diode. We first briefly review the concept and principle of the pMOS pixel detector, before presenting simulation and test performed on the prototypes with a beam of minimum ionizing particles.

Characterization of an ONO-stacked insulator film for a silicon micro-strip detector

Abstract A semi-empirical model for an ONO-stacked insulator film is presented together with its implications. The model covers ONO, ON, and NO films as well as single-layered SiO 2 and Si 3 N 4 . We eventually present an assessment for estimating the lifetime of an ONO-stacked insulator film for a given configuration.

Development of novel fabrication techniques for a silicon micro-vertex detector unit using the Flip-Chip bonding method

Full-size models of a detector unit for a silicon micro-vertex detector were built for the KEK B factory. The Flip-Chip Bonding (FCB) method using a new type anisotropic conductive film (ACF) was examined. The structure using the new type ACF and improved fabrication process provide a sufficient electrical connection and good reliability for the detector unit. >

Development of new assembly techniques for a silicon micro-vertex detector unit using the flip-chip bonding method

Abstract Full-size models of a detector unit for a silicon micro-vertex detector were built for the KEK B factory. The Flip-Chip Bonding (FCB) method using a new type anisotropic conductive film was examined. The structure using the FCB method successfully provides a new architecture for the silicon micro-vertex detector unit.