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Dive into the research topics where Keiichi Higashitani is active.

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Featured researches published by Keiichi Higashitani.


custom integrated circuits conference | 1990

A bipolar-PMOS merged basic cell for 0.8 mu m BiCMOS sea-of-gates

Toshiaki Hanibuchi; Masahiro Ueda; Keiichi Higashitani; Masahiro Hatanaka; Koichiro Mashiko

To improve the density of BiCMOS sea-of-gates, bipolar and PMOS transistors are merged to form compact basic cells combined with the gate isolation technique. This structure occupies only 12% of the conventional bipolar transistor area. The density of the basic cell increases by 60% compared with conventional cells. The pull-up BiCMOS circuit achieves the fastest gate delay of 200 ps. A 16-bit multiplier in the test chip fabricated with 0.8 mu m BiCMOS technology operates at 18 ns delay time.<<ETX>>


custom integrated circuits conference | 1991

Submicron CBiCMOS technology with new well and buried layer formed by multiple energy ion implantation

Keiichi Higashitani; T. Kuroi; K. Suda; Masahiro Hatanaka; Shigeo Nagao; N. Tsubouchi

A simple 0.6- mu m complementary BiCMOS (CBiCMOS) technology was developed without an epitaxial layer. The wells and the buried layers for all transistors were formed by only three steps of masking layers, using multiple energy ion implantation with megaelectronvolt energy. The problem of the secondary defect induced by high dose and high energy ion implementation was solved by using the rapid thermal annealing technique. The cutoff frequencies for n-p-n and p-n-p were 11 GHz and 5 GHz, respectively. Using this technology, high-performance LSIs including mixed analog/digital devices can be developed.<<ETX>>


IEEE Journal of Solid-state Circuits | 1991

A bipolar-PMOS merged basic cell for 0.8 mu m BiCMOS sea of gates

Toshiaki Hanibuchi; Masahiro Ueda; Keiichi Higashitani; Masahiro Hatanaka; Koichiro Mashiko; Akiharu Tada

A compact basic cell for BiCMOS sea-of-gates (SOG) circuits was developed using a bipolar-PMOS merged structure and gate-isolated bipolar transistors. The new cell structure reduces the cell area using the bipolar-PMOS merged transistors. The cell has no restrictions regarding macrocell placement because it has no shared element. The cell density is 60% higher than that of conventional cells. Three types of circuits are provided for a macrocell using the basic cell. The pull-up BiCMOS circuit, one of the circuit alternatives, obtains the shortest gate delay with average load capacitance and high density comparable to a pure CMOS density. The gate delay of 200 ps was achieved with the pull-up BiCMOS two-input NAND gate fabricated with 0.8- mu m BiCMOS technology. >


Archive | 1997

Semiconductor device with gate electrode portion and method of manufacturing the same

Motoshige Igarashi; Hiroyuki Amishiro; Keiichi Higashitani


Archive | 1998

Semiconductor device with improved planarity and reduced parasitic capacitance

Hiroshi Kawashima; Masakazu Okada; Keiichi Yamada; Keiichi Higashitani


Archive | 2002

Method of manufacturing a semiconductor device, and a semiconductor device manufactured thereby

Masakazu Okada; Keiichi Higashitani; Hiroyuki Chibahara


Archive | 1999

Semiconductor device with self-aligned contact structure

Kenji Yoshiyama; Keiichi Higashitani


Archive | 1998

SEMICONDUCTOR DEVICE HAVING AN IMPROVED INTERLAYER CONTACT AND MANUFACTURING METHOD THEREOF

Masakazu Okada; Keiichi Higashitani; Hiroshi Kawashima


Archive | 1999

Layout of well contacts and source contacts of a semiconductor device

Keiichi Yamada; Atsushi Maeda; Kenji Yoshiyama; Keiichi Higashitani


Archive | 2003

Semiconductor device including multiple field effect transistors and manufacturing method thereof

Kenji Yoshiyama; Motoshige Igarashi; Keiichi Yamada; Katsuya Okada; Keiichi Higashitani

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