Kelly W. Kyler
Motorola
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Publication
Featured researches published by Kelly W. Kyler.
IEEE Journal of Solid-state Circuits | 2003
Mark Durlam; P.J. Naji; A. Omair; Mark DeHerrera; J. Calder; Jon M. Slaughter; Bradley N. Engel; Nicholas D. Rizzo; Gregory W. Grynkewich; B. Butcher; C. Tracy; Kenneth H. Smith; Kelly W. Kyler; J. Jack Ren; J.A. Molla; W.A. Feil; R.G. Williams; Saied N. Tehrani
A low-power 1-Mb magnetoresistive random access memory (MRAM) based on a one-transistor and one-magnetic tunnel junction (1T1MTJ) bit cell is demonstrated. This is the largest MRAM memory demonstration to date. In this circuit, the magnetic tunnel junction (MTJ) elements are integrated with CMOS using copper interconnect technology. The copper interconnects are cladded with a high-permeability layer which is used to focus magnetic flux generated by current flowing through the lines toward the MTJ devices and reduce the power needed for programming. The 25-mm/sup 2/ 1-Mb MRAM circuit operates with address access times of less than 50 ns, consuming 24 mW at 3.0 V and 20 MHz. The 1-Mb MRAM circuit is fabricated in a 0.6-/spl mu/m CMOS process utilizing five layers of metal and two layers of poly.
symposium on vlsi circuits | 2002
Mark Durlam; P. Naji; A. Omair; Mark DeHerrera; J. Calder; Jon M. Slaughter; B. Engel; Nicholas D. Rizzo; Gregory W. Grynkewich; B. Butcher; C. Tracy; Kenneth H. Smith; Kelly W. Kyler; J. Ren; J. Molla; B. Feil; R. Williams; Saied N. Tehrani
A low power 1 Mb Magnetoresistive Random Access Memory (MRAM) based on a 1-Transistor and 1-Magnetic Tunnel Junction (1T1MTJ) bit cell is demonstrated. This is the largest MRAM memory demonstration to date. In this circuit, MTJ elements are integrated with CMOS using copper interconnect technology. The copper interconnects are cladded with a high permeability layer which is used to focus magnetic flux generated by current flowing through the lines toward the MTJ devices and reduce the power needed for programming the bits. The 25 mm/sup 2/ 1 Mb MRAM circuit operates with address access times of less than 50 ns, consuming 24 mW at 3.0 V and 20 MHz. The circuit is fabricated in a 0.6 /spl mu/m CMOS process utilizing five layers of metal and two layers of poly.
Archive | 1999
Mark Durlam; Gloria Kerszykowski; Jon M. Slaughter; Theodore Zhu; Eugene Chen; Saied N. Tehrani; Kelly W. Kyler
Archive | 2001
Mark Durlam; Eugene Youjun Chen; Saied N. Tehrani; Jon M. Slaughter; Gloria Kerszykowski; Kelly W. Kyler
Archive | 1998
Mark Durlam; Gloria Kerszykowski; Jon M. Slaughter; Eugene Chen; Saied N. Tehrani; Kelly W. Kyler; X. Theodore Zhu
Archive | 2001
Mark Durlam; Mark DeHerrera; Eugene Chen; Saied N. Tehrani; Gloria Kerszykowski; Peter K. Naji; Jon M. Slaughter; Kelly W. Kyler
Archive | 2003
Eugene Youjun Chen; Mark Durlam; Saied N. Tehrani; Mark DeHerrera; Gloria Kerszykowski; Kelly W. Kyler
Archive | 2003
Gregory W. Grynkewich; Brian R. Butcher; Mark Durlam; Kelly W. Kyler; Kenneth H. Smith; Clarence J. Tracy
Archive | 2005
Gregory W. Grynkewich; Brian R. Butcher; Mark Durlam; Kelly W. Kyler; Charles A. Synder; Kenneth H. Smith; Clarence J. Tracy; Richard G. Williams
Archive | 2004
Eugene Youjun Chen; Mark Durlam; Saied N. Tehrani; Mark DeHerrera; Gloria Kerszykowski; Kelly W. Kyler