Kenya Kawano
Hitachi
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Featured researches published by Kenya Kawano.
ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference | 2007
Kisho Ashida; Akira Muto; Ichio Shimizu; Kenya Kawano; Naotaka Tanaka; Nae Yoneda
We developed a new packaging technology, one that uses double-sided cooling to dramatically reduce the on-resistance and thermal resistance. The main features of this technology are as follows. Both sides of the chip are soldered to copper leadframes. After that, copper leadframes soldered to the top and bottom of the chip are exposed when transfer molding encapsulates the package. There were two development problems with packaging technology. The first is how to prevent chip crack in the reflow process. The second is how to improve the fatigue life of solder during the temperature cycling. To solve these problems, we designed our package structure using an experimental design method. In particular, for the second problem, we quantitatively calculated the amount of solder fatigue fracture and the number of cycles using the solder crack propagation analysis method, because the performance of the package depends on the amount of solder fatigue fracture. As a result, we could create a condition that prevented chip crack and improved the fatigue life of solder by the twice compared to the first prototype and determined the optimum structure. We assembled a new package based on this optimum structure, and confirmed this improvement of the reliability. In addition, we measured the on-resistance and thermal resistance of this package and that of the existing package available. We found that the new package’s on-resistance and thermal resistance decreased to about 70 and 80% that of the existing package respectively.Copyright
electronic components and technology conference | 1992
Hiroaki Doi; Kenya Kawano; R. Minamitani; Toshio Hatsuda; T. Hayashida
A controlled displacement mechanical fatigue test machine for specimens of flip-chip solder joints has been developed using PZT actuators. The extension response of the PZT exhibits good linearity using a charge control circuit. As a result of this control, errors in the strain of the specimen caused by the deflection of the test machine frame can be corrected by measuring the load. This test machine produces a cycle constant strain range in the solder joints. A fatigue test is conducted for specimens of flip-chip solder joints, and the fatigue strength of the joints is obtained. The strength of the joints seems to be higher than that of bulk solder.<<ETX>>
Journal of Electronic Packaging | 2004
Naotaka Tanaka; Kenya Kawano; Hideo Miura; Yoshiyuki Kado; Ikuo Yoshida
Archive | 1999
Kenya Kawano; Hiroaki Doi; Akio Yasukawa; Hideo Miura
Journal of Electronic Packaging | 1998
H. Doi; Kenya Kawano; A. Yasukawa; T. Sato
Archive | 2005
Naotaka Tanaka; Kenya Kawano; Akira Nagai; Koji Tasaki; Masaaki Yasuda
Journal of Japan Institute of Electronics Packaging | 2014
Kenya Kawano; Yasuhiro Naka; Hisashi Tanie; Ryosuke Kimoto; Kenichi Yamamoto
Archive | 2005
Naotaka Tanaka; Kenya Kawano; Akira Nagai; Koji Tasaki; Masaaki Yasuda
The Proceedings of Mechanical Engineering Congress, Japan | 2011
Kenya Kawano; Yasuhiro Naka; Hisashi Tanie; Ryosuke Kimoto; Ken-ichi Yamamoto
Transactions of the Japan Society of Mechanical Engineers. A | 2010
Kisho Ashida; Kenya Kawano; Naotaka Tanaka; Atsushi Nishikizawa; Nobuya Koike