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Ryosuke Kimoto

Hitachi

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Publication

Featured researches published by Ryosuke Kimoto.

Archive | 1992

Semiconductor device with lead structure within the planar area of the device

Kunihiro Tsubosaki; Michio Tanimoto; Kunihiko Nishi; Masahiro Ichitani; Shunji Koike; Kazunari Suzuki; Ryosuke Kimoto; Ichiro Anjoh; Taisei Jin; Akihiko Iwaya; Gen Murakami; Masamichi Ishihara; Junichi Arita

Archive | 2002

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME, ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME

Ryosuke Kimoto; Toshiaki Morita; Munehiro Yamada; Kenichi Yamamoto; 俊章 守田; 健一 山本; 宗博 山田; 良輔 木本

Archive | 2005

Semiconductor device and manufacturing metthod thereof

Chuichi Miyazaki; Yukiharu Akiyama; Masnori Shibamoto; Tomoaki Kudaishi; Ichiro Anjoh; Kunihiko Nishi; Asao Nishimura; Hideki Tanaka; Ryosuke Kimoto; Kunihiro Tsubosaki; Akio Hasebe; Takehiro Ohnishi; Noriou Shimada; Shuji Eguchi; Hiroshi Koyama; Akira Nagai; Masahiko Ogino

Archive | 2000

Bump formation method

Kosuke Inoue; Tatsuya Yoneda; Takamichi Suzuki; Ryosuke Kimoto; Junichi Suzuki

Archive | 1996

Semiconductor device with lead structure on principal surface of chip

Kunihiro Tsubosaki; Michio Tanimoto; Kunihiko Nishi; Masahiro Ichitani; Shunji Koike; Kazunari Suzuki; Ryosuke Kimoto; Ichiro Anjoh; Taisei Jin; Akihiko Iwaya; Gen Murakami; Masamichi Ishihara; Junichi Arita

Archive | 2003

Method for manufacturing semiconductor device and electronic device and method for calculating connection condition

Shiro Yamashita; Masahide Harada; Kenichi Yamamoto; Munehiro Yamada; Ryosuke Kimoto

Journal of Japan Institute of Electronics Packaging | 2010

Establishment of Estimate Methods on Impact Strength of Lead-Free Solder Joints in BGA Packages (1) Dependence of Failure Modes of Solder Joints under Impact Load on Strain of PWB

Akihiro Yaguchi; Hisashi Tanie; Yasuhiro Naka; Kenichi Yamamoto; Ryosuke Kimoto; Nobutada Ohno

Archive | 2004

Semiconductor device, method for manufacturing the same and a wiring substrate

Ken-ichi Yamamoto; Haruo Akahoshi; Ryosuke Kimoto; Takashi Miwa

Journal of Japan Institute of Electronics Packaging | 2014

Fatigue Life Prediction of Solder Joints with the Consideration of High-Temperature Degradation

Kenya Kawano; Yasuhiro Naka; Hisashi Tanie; Ryosuke Kimoto; Kenichi Yamamoto

Archive | 2000

Aggregate of semiconductor devices including semiconductor packages arranged on a first tape and wound on a reel and also including a spacer tape provided with spacers

Kosuke Inoue; Tatsuya Yoneda; Takamichi Suzuki; Ryosuke Kimoto; Junichi Suzuki

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Yasuhiro Naka

Hitachi

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Hisashi Tanie

Nagoya University

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Kenichi Yamamoto

Hitachi

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Akihiro Yaguchi

Hitachi

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Ken-ichi Yamamoto

Kyushu University

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Ichiro Anjoh

Hitachi

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Kenya Kawano

Hitachi

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Kunihiko Nishi

Hitachi

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Kunihiro Tsubosaki

Hitachi

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Masahiro Ichitani

Hitachi

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