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Dive into the research topics where Kevin J. Hess is active.

Publication


Featured researches published by Kevin J. Hess.


Archive | 2013

Stacked semiconductor devices

Perry H. Pelley; Kevin J. Hess; Michael B. McShane


Archive | 2007

Method of packaging semiconductor devices

Kevin J. Hess; Chu-Chung Lee; Robert J. Wenzel


Archive | 2004

Scribe street structure for backend interconnect semiconductor wafer integration

Trent S. Uehling; Kevin J. Hess


Archive | 2008

Packaged integrated circuit with enhanced thermal dissipation

Kevin J. Hess; Chu-Chung Lee


Archive | 2005

Method and apparatus for providing structural support for interconnect pad while allowing signal conductance

Kevin J. Hess; Susan H. Downey; James W. Miller; Cheng Choi Yong


Archive | 2005

Integrated circuit having structural support for a flip-chip interconnect pad and method therefor

Scott K. Pozder; Kevin J. Hess; Pak Leung; Edward O. Travis; Brett Wilkerson; David G. Wontor; Jie-Hua Zhao


Archive | 2007

Die level metal density gradient for improved flip chip package reliability

Scott K. Pozder; Kevin J. Hess; Ruiqi Tian; Edward O. Travis; Trent S. Uehling; Brett Wilkerson; Katie C. Yu


Archive | 2005

Semiconductor die edge reconditioning

Yuan Yuan; Kevin J. Hess; Chu-Chung Lee; Tu-Anh Tran; Alan H. Woosley


Archive | 2011

Fused buss for plating features on a semiconductor die

George R. Leal; Kevin J. Hess; Trent S. Uehling


Archive | 2007

Power Lead-on-Chip Ball Grid Array Package

James P. Johnston; Chu-Chung Lee; Tu-Anh N. Tran; James W. Miller; Kevin J. Hess

Collaboration


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Tu-Anh Tran

Freescale Semiconductor

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