Kinya Ichikawa

Printed circuit substrate with solder formed on pad-on-via and pad-off-via contacts thereof

Encapsulation of a stack of semiconductor dice

Molded flip chip package

Encapsulated stack of dice and support therefor

Method for controlling solder bump height and volume for substrates containing both pad-on and pad-off via contacts

Substrate connector for integrated circuit devices

Patch substrate for external connection

Encapsulated die, microelectronic package containing same, and method of manufacturing said microelectronic package

HIGH DENSITY SUBSTRATE INTERCONNECT USING INKJET PRINTING

Design for flip chip joint pad/LGA pad