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Kinya Ichikawa

Intel

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Publication

Featured researches published by Kinya Ichikawa.

Archive | 1996

Printed circuit substrate with solder formed on pad-on-via and pad-off-via contacts thereof

Kenzo Ishida; Yohko Mashimoto; Kinya Ichikawa

Archive | 2002

Encapsulation of a stack of semiconductor dice

Masayuki Akiba; Kinya Ichikawa; Jiro Kubota; Takashi Kumamoto

Archive | 2003

Molded flip chip package

Takashi Kumamoto; Kinya Ichikawa

Archive | 2004

Encapsulated stack of dice and support therefor

Masayuki Akiba; Kinya Ichikawa; Jiro Kubota; Takashi Kumamoto

Archive | 1996

Method for controlling solder bump height and volume for substrates containing both pad-on and pad-off via contacts

Kenzo Ishida; Yohko Mashimoto; Kinya Ichikawa

Archive | 2005

Substrate connector for integrated circuit devices

Kinya Ichikawa

Archive | 2006

Patch substrate for external connection

Kinya Ichikawa

Archive | 2011

Encapsulated die, microelectronic package containing same, and method of manufacturing said microelectronic package

John S. Guzek; Robert L. Sankman; Kinya Ichikawa; Yoshihiro Tomita; Jiro Kubota

Archive | 2013

HIGH DENSITY SUBSTRATE INTERCONNECT USING INKJET PRINTING

Chia-Pin Chiu; Kinya Ichikawa; Robert L. Sankman

Archive | 1996

Design for flip chip joint pad/LGA pad

Kinya Ichikawa; Seiichiroh Seki; Takaya Miwa; Yohko Mashimoto

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Jiro Kubota

Intel

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Robert L. Sankman

Intel

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Chia-Pin Chiu

Intel

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Kenzo Ishida

Intel

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Yohko Mashimoto

Intel

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Yoshihiro Tomita

Intel

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Yukihiro Murakami

Intel

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Bob Sankman

Intel

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Eric J. Li

Intel

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John S. Guzek

Intel

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