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Dive into the research topics where Kiyoto Watabe is active.

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Featured researches published by Kiyoto Watabe.


international symposium on power semiconductor devices and ic s | 2001

A half-bridge driver IC with newly designed high voltage diode

Kiyoto Watabe; Kazuhiro Shimizu; Hajime Akiyama; Toru Araki; Junichi Moritani; Masanori Fukunaga

A newly designed diode is proposed and demonstrated in action experimentally. The new device has successfully increased forward current without additional mask and increase of the area. Remarkable improvement in the reverse recovery characteristic of the new diode can be realized by electron irradiation. The fabricated ICs with the new diode operated at 3 kHz PWM carrier frequency.


international symposium on power semiconductor devices and ic s | 1996

A 0.8 /spl mu/m high voltage IC using newly designed 600 V lateral IGBT on thick buried-oxide SOI

Kiyoto Watabe; H. Akiyama; Tomohide Terashima; Shinji Nobuto; M. Yamawaki; T. Hirao

We have demonstrated that the developed process has a breakdown voltage of higher than 600 V with use of thick buried-oxide and thin SOI. From both experiments and simulations, the cylindrical structure in the LIGBTs shows the best performance; it improves the latch-up tolerance without the increase of on-state voltage. Moreover, the process we have developed is completely compatible with an existing 5 V, 0.8 /spl mu/m CMOS process.


IEEE Journal of Solid-state Circuits | 1998

An 0.8-/spl mu/m high-voltage IC using a newly designed 600-V lateral p-channel dual-action device on SOI

Kiyoto Watabe; Hajime Akiyama; Tomohide Terashima; Masakazu Okada; Shinji Nobuto; Masao Yamawaki; Sotoju Asai

A novel lateral power device, termed a p-channel dual-action device (p-ch DAD), is proposed and experimentally demonstrated in action. This device is based on a new dual-action mechanism. The new device has successfully increased on-state current without lowering the device breakdown voltage. The 600-V level-shifting action of the p-ch DAD has been confirmed by a circuit experiment. A newly designed p-ch DAD on the silicon on insulator can be made by adding four additional masks and trench technology to a 0.8-/spl mu/m CMOS process. Moreover, the process we have developed is completely compatible with an existing 5-V 0.8-/spl mu/m CMOS process.


bipolar/bicmos circuits and technology meeting | 1997

A novel p-channel dual action device for HVIC

Kiyoto Watabe; H. Akiyama; T. Terashima; M. Okada; S. Nobuto; M. Yamawaki; S. Asai

A novel lateral power device termed p-channel Dual Action Device (p-ch DAD) is proposed and demonstrated in action experimentally. The new device has successfully increased on-state current without lowering the device breakdown voltage. 600 V level-shifting action of the p-ch DAD has been confirmed by a circuit experiment.


international symposium on power semiconductor devices and ic s | 1998

A new phenomenon of p-channel dual action device

Kiyoto Watabe; Hajime Akiyama; Tomohide Terashima; Shinji Nobuto; Masanori Fukunaga; Masao Yamawaki

A novel lateral power device termed the p-channel dual action device (p-ch DAD) is proposed and demonstrated in action experimentally and numerically. It consists of a p-channel HVMOS, n-channel HVMOS and resistance. This hybrid device has increased on-state current without lowering the device breakdown voltage. The conductivity modulation of the new device is discussed.


Archive | 1989

Method for manufacturing interconnection structure in semiconductor device

Tatsuo Okamoto; Hideo Kotani; Takio Oono; Kiyoto Watabe; Yasushi Kinoshita; Yoshikazu Nishikawa


Archive | 1989

Content addressable memory device

Kiyoto Watabe; Hirofumi Shinohara; Takahisa Eimori; Hideaki Arima; Natsuo Ajika; Yuichi Nakashima; Shinichi Satoh


Archive | 1992

Method of manufacturing an MIS device having lightly doped drain structure and conductive sidewall spacers

Kiyoto Watabe; Katsuyoshi Mitsui; Masahide Inuishi


Archive | 1995

Semiconductor device having insulated gate bipolar transistor

Kiyoto Watabe; Ikunori Takata; Masana Harada


Archive | 1988

Interconnection structure in semiconductor device and manufacturing method of the same

Tatsuo Okamoto; Hideo Kotani; Takio Oono; Kiyoto Watabe; Yasushi Kinoshita; Yoshikazu Nishikawa

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