Kris Van Nieuwenhuysen

Chirped porous silicon reflectors for thin-film epitaxial silicon solar cells

The studies of porous silicon as a one-dimensional photonic crystal have led to solutions allowing the fabrication of broad photonic band gaps as large as several hundreds nanometers for various types of applications. In this work we demonstrate the use of the chirping process, i.e., the gradual increase in the spatial period of the structure, as it is used in image processing, to design porous silicon broad-band reflectors for thin-film silicon solar cells. Modeling of those layers is done using linear design method and a simulation software. Such chirped structures are fabricated by an anodization process. Samples are prepared on mono and multicrystalline silicon substrates with 15, 40, 60, and 80 layers. The reflectance spectra of such prepared porous reflectors are evaluated and the results show an increase in bandwidth of over 50% of the total width in comparison with the conventional, unchirped reflectors. We demonstrate clear advantages of introducing chirped multilayer structures over conventional...

Improving the Quality of Epitaxial Foils Produced Using a Porous Silicon-based Layer Transfer Process for High-Efficiency Thin-Film Crystalline Silicon Solar Cells

A porous silicon-based layer transfer process to produce thin (30-50 μm) kerfless epitaxial foils (epifoils) is a promising approach toward high-efficiency solar cells. For high efficiencies, the epifoil must have high minority carrier lifetimes. The epifoil quality depends on the properties of the porous layer since it is the template for epitaxy. It is shown that by reducing the thickness of this layer and/or its porosity in the near-surface region, the near-surface void size is reduced to <;65 nm and in certain cases achieve a 100 nm-thick void-free zone below the surface. Together with better void alignment, this allows for a smoother growth surface with a roughness of <;35 Å and reduced stress in the porous silicon. These improvements translate into significantly diminished epifoil crystal defect densities as low as ~420 defects/cm 2. Although epifoils on very thin porous silicon were not detachable, a significant improvement in the lifetime (diffusion length) of safely detachable n-type epifoils from ~85 (~300 μm) to ~195 μs (~470 μm) at the injection level of 10 15/cm 3 is achieved by tuning the porous silicon template. Lifetimes exceeding ~350 μs have been achieved in the reference lithography-based epifoils, showing the potential for improvement in porous silicon-based epifoils.

High-quality epitaxial foils, obtained by a layer transfer process, for integration in back-contacted solar cells processed on glass

Foil creation by lifting off a thin layer of a high quality silicon substrate is one of the promising substitutes for wafer sawing to create substrates thinner than 100 μm. The porous silicon-based layer transfer process is a well known method to obtain high quality foils. Despite a number of convincing lab-based solar cell show-cases, there is no breakthrough of this technology at (semi)-industrial level, because of the poor yield of processing free standing foils. This paper presents a method to fabricate back contacted solar cells based on epitaxial foils avoiding processes on free-standing foils. First, a porous silicon layer is electrochemically etched, acting as a weak sacrificial layer to detach the foil that is epitaxially grown on top of the porous silicon layer. Characterization of the epitaxial foils shows a good crystalline quality and an effective lifetime around 100 μs. Those results give indications that the obtained foils are well suited for solar cell fabrication. Front-side processing is done while the epitaxial foil is still attached to its parent substrate. A good yield is obtained for epitaxial foils that underwent the front-side processing sequence consisting of wet chemical texturing, FSF formation, passivation and ARC deposition. Afterwards, the front-side of the foil is bonded to a glass carrier and the foil is detached from its parent substrate. Silicone adhesives are used for this permanent bond. The rear-side of the solar cell is processed while bonded to glass. Therefore, only low temperature processes (<;200°C) can be used. So far, the rear-side processing sequence was performed on Float-zone reference wafers as a proof of concept resulting in a confirmed maximum efficiency of 18.4%. The rear-side processing sequence still needs to be applied on epitaxial foils.

Tuning of strain and surface roughness of porous silicon layers for higher-quality seeds for epitaxial growth

Sintered porous silicon is a well-known seed for homo-epitaxy that enables fabricating transferrable monocrystalline foils. The crystalline quality of these foils depends on the surface roughness and the strain of this porous seed, which should both be minimized. In order to provide guidelines for an optimum foil growth, we present a systematic investigation of the impact of the thickness of this seed and of its sintering time prior to epitaxial growth on strain and surface roughness. Strain and surface roughness were monitored in monolayers and double layers with different porosities as a function of seed thickness and of sintering time by high-resolution X-ray diffraction and profilometry, respectively. Unexpectedly, we found that strain in double and monolayers evolves in opposite ways with respect to layer thickness. This suggests that an interaction between layers in multiple stacks is to be considered. We also found that if higher seed thickness and longer annealing time are to be preferred to minimize the strain in double layers, the opposite is required to achieve smoother layers. The impact of these two parameters may be explained by considering the morphological evolution of the pores upon sintering and, in particular, the disappearance of interconnections between the porous seed and the bulk as well as the enlargement of pores near the surface. An optimum epitaxial growth hence calls for a trade-off in seed thickness and annealing time, between minimum-strained layers and rougher surfaces.PACS codes81.40.-z Treatment of materials and its effects on microstructure, nanostructure, and properties; 81.05.Rm Porous materials; granular materials; 82.80.Ej X-ray, Mössbauer and other γ-ray spectroscopic analysis methods

Epitaxial Solar Cells Over Upgraded Metallurgical Silicon Substrates: The Epimetsi Project

In order to overcome the shortage of silicon feedstock that is currently affecting the photovoltaic industry, many efforts are being dedicated to the search of alternative substrates for solar cells. One of the possible solutions is to use low-cost substrates of upgraded metallurgical silicon, for which there are no supply issues. The solar cell is built on a thin layer of high quality silicon which is epitaxially grown over this substrate, with the use of a high throughput epitaxial reactor of novel design. This reactor can be fed with electronic grade source gases or with gases obtained in situ from metallurgical silicon. A reactor prototype has been constructed with a capacity of 50 wafers per run and a deposition velocity of approximately 2 microns per minute. The production of chlorosilanes by Si etching and the recirculation of gases for maximum efficiency are being studied. A solar cell process specific for these substrates has been developed, achieving an efficiency of 12,8%. Further improvements on the solar cell process are under investigation, with special emphasis on light trapping by plasma texturing and the application of a porous Si layer as internal reflector. A preliminary market study has been performed to understand the role of silicon feedstock in the current photovoltaic market and its projection in the next decades, looking at the expected role of epitaxial solar cells

Module-level cell processing of silicon heterojunction interdigitated back-contacted (SHJ-IBC) solar cells with efficiencies above 22%: Towards all-dry processing

Module-level processing of silicon heterojunction interdigitated back-contacted (SHJ-IBC) solar cells while bonded to glass, in the so-called i2-module concept, is discussed. In this approach, a key challenge is the interdigitated patterning of a-Si:H without compromising on the rear-surface passivation. Process adaptations involving more resistant bonding agents and a milder wet etchant enabled bonded cells with the best efficiency of 21.7% and Voc of 734 mV, which are the highest reported for bonded cells processed partially at module level, and which undoubtedly proves the potential of this i2-module concept to reach high Voc and efficiency. Yet another challenge is to make the process flow cost-effective and industrially-relevant, i.e. a litho-free, all-dry process flow, analogous to thin-film PV module fabrication. As a first step, dry etching of a-Si:H was developed to replace wet etching, and was successfully incorporated in a SHJ-IBC process flow to fabricate freestanding cells with the best efficiency of 22.9% and above 20% on thick (190 μm) and thin (56 μm) EVA-bonded silicon.

Plasma Texturing and Porous Silicon Mirrors for Epitaxial Thin Film Crystalline Silicon Solar Cells

Thin film silicon solar cells, consisting of an epitaxially grown active layer on a low quality highly doped silicon substrate, incorporate many attractive features usually associated with their sister cells based on bulk silicon. However, the efficiency of the current epitaxial semiindustrial screen printed cells is limited to 11-12% mainly due to optical shortcomings. This paper will give an overview of our work aimed at tackling the 2 most important problems: (i) Finding and implementing an adequate front surface texture and (ii) the simulation, fabrication and incorporation of an intermediate reflector. The former issue has been addressed by the development of plasma texturing based on halogen species. This method allows us to fulfil the sometimes contradictory requirements for the textured surface, i.e. a uniform and reduced reflection, a strong lambertian character to scatter the light and a limited removal of silicon. It will be shown that the scattering efficiency is dependent on both the wavelength of the impinging light and on the silicon removal during the texturing process. The second and main issue of this work is the limited absorption volume of the epitaxial layer. To resolve this drawback, an intermediate reflector is placed at the epi/substrate interface to enhance the path length of the low energy photons through the epi-layer. In practice, a multilayer porous silicon stack is created by electrochemical anodization of the substrate. The reflection at the epi/reflector/substrate interface is a combination of several different effects including a Bragg mirror and Total Internal Reflection (TIR). Measurements of the external reflectance as well as extraction of the internal reflection parameters are used to clarify the issue. Advanced structures, including chirped porous silicon stacks, are introduced. Finally, the benefits of the reflector on the level of the epitaxial silicon solar cell are analysed. Efficiencies close to 14% are obtained for epitaxial cells incorporating an advanced porous Si reflector.

Thin-Film Polycrystalline-Silicon Solar Cells on Ceramic Substrates Made by Aluminum-Induced Crystallization and Thermal CVD

A considerable cost reduction could be achieved in photovoltaics if efficient solar cells could be made from thin polycrystalline-silicon (pc-Si) layers. Aluminum-induced crystallization (AIC) of amorphous silicon followed by epitaxial thickening is an effective way to obtain large-grained pc-Si layers with excellent properties for solar cells. To obtain efficient solar cells, the electronic quality of the pc-Si material obtained by AIC has to be optimized and the cell design has to be adapted to the material. In this paper, we report on pc-Si solar cells made by AIC in combination with thermal CVD on ceramic alumina substrates. We made pc-Si solar cells on alumina substrates that showed Voc values up to 533 mV and efficiencies up to 5.9%. This is the highest efficiency ever achieved with pc-Si solar cells on ceramic substrates where no (re)melting of silicon was used. We demonstrate that the quality of the pc-Si material can be improved drastically by reducing the substrate roughness using spin-on oxides. We further show that a-Si/c-Si heterojunctions lead to much higher Voc values than diffused homojunctions. A cell concept that incorporates spin-on oxides and heterojunction emitters is therefore best suited to obtain efficient pc-Si solar cells on alumina substrates.

2D periodic photonic nanostructures integrated in 40 _x0019_

Two-dimensional (2D) periodic photonic nanostructures are fabricated by nanoimprint lithography (NIL) and dry plasma (Dry-NIL) etching on 40 μm thick epitaxially-grown crystalline silicon (c-Si) foils, resulting in nanostructures with a parabolic profile. These nanostructures are integrated in a 40 μm thick double side contacted c-Si/aSi:H heterojunction solar cell architecture. The front side is processed when the foil is attached to the parent substrate while the back side is processed when the foil is bonded to the glass carrier. Although the efficiency of the nanopatterned cell was lower compared to the random pyramid textured cells it had a better absorption and spectral response for long wavelengths, highlighting a better light trapping behavior.

lm thin crystalline silicon solar cells

In epitaxial silicon solar cells grown on low-cost substrates, an embedded porous silicon layer is used to block metal diffusion from the substrate into the epitaxial active layer. The gettering efficiency of porous silicon can be enhanced by reducing the pore radius. In the size range (27.2 nm-39.8 nm) investigated, the additional curvature of the 27.2 nm void leads to >200 meV improvement in the binding energy for both copper and nickel, enhancing the gettering efficiency by >10 times. This is due to the existence of specific binding sites which allows greater dangling bond passivation in smaller voids.