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Dive into the research topics where Kyoung-seon Kim is active.

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Featured researches published by Kyoung-seon Kim.


Soft Matter | 2010

Block copolymer multiple patterning integrated with conventional ArF lithography

Seung Hak Park; Dong Ok Shin; Bong Hoon Kim; Dong Ki Yoon; Kyoung-seon Kim; Si Yong Lee; Seok-Hwan Oh; Seong-Woon Choi; Sang Chul Jeon; Sang Ouk Kim

We present block copolymer multiple patterning as an efficient and truly scalable nanolithography for sub-20 nm scale patterning, synergistically integrated with conventional ArF lithography. The directed assembly of block copolymers on chemically patterned substrates prepared by ArF lithography generated linear vertical cylinder arrays with a 20 to 30 nm diameter, enhancing the pattern density of the underlying chemical patterns by a factor of two or three. This self-assembled resolution enhancement technique affords a straightforward route to highly ordered sub-20 nm scale features via conventional lithography.


Proceedings of SPIE | 2013

Patterning process for semiconductor using directed self assembly

Jaewoo Nam; Eun Sung Kim; Dae-Keun Kang; Hangeun Yu; Kyoung-seon Kim; Shi-Yong Yi; Chul-Ho Shin; Ho-Kyu Kang

Directed self-assembly (DSA) process of block copolymers (BCPs) has been considered as a candidate for sub-20nm contact patterning. In recent years the semiconductor manufacturers have been interested in use DSA in production. DSA is based on the intrinsic property of the BCPs which is phase-separation in the molecular scale, but significant problems remain for device application. Process time, high process temperature, defect, and CD distribution make the using of DSA difficult in mass production. One of the most considered problems for DSA is the CD Distribution. A guide material for grapho-epitaxy DSA process requires resistance against high temperature and solvent. We use negative tone develop (NTD) photoresist (PR) guide for simple process and thermal resistance, and additional treatment for resistance against high temperature and solvent. The CD distribution of DSA is highly related to the phase separation itself. In order to get better performance, the polymer chains should have sufficient mobility under heating above their glass temperature. Therefore, film thickness and molecular weight of BCPs are very important parameters for CD distribution of DSA process. From the results, it is proven that guide materials, film thickness of BCPs, and molecular weight of BCPs are significant parameter in order to improve CD distribution of DSA patterns.


Archive | 2009

Method of forming fine pattern using block copolymer

Dong Ki Yoon; Shi-Yong Yi; Seok-Hwan Oh; Kyoung-seon Kim; Sang Ouk Kim; Seung-hak Park


Archive | 2008

Oligomer probe array

Won-Sun Kim; Jung-Hwan Hah; Sung-min Chi; Kyoung-seon Kim; Man-Hyoung Ryoo


Archive | 2007

Oligomer Probe Array with Improved Signal-to-Noise Ratio and Detection Sensitivity and Method of Manufacturing the Same

Jung-Hwan Hah; Sung-min Chi; Kyoung-seon Kim; Won-Sun Kim


Archive | 2008

MICROARRAY, SUBSTRATE FOR MICROARRAY AND METHODS OF FABRICATING THE SAME

Sun-Ok Jung; Song-Jun Choi; Man-Hyoung Ryoo; Sung-min Chi; Jung-Hwan Hah; Kyoung-seon Kim; Won-Sun Kim


Archive | 2007

Method of Manufacturing a Microarray

Jung-Hwan Hah; Sung-min Chi; Kyoung-seon Kim; Won-Sun Kim


Archive | 2007

DNA chip, DNA chip kit, and method of manufacturing the DNA chip

Won-Sun Kim; Sung-min Chi; Jung-Hwan Hah; Kyoung-seon Kim


Archive | 2007

Oligomer probe array and method of producing the same

Jung-Hwan Hah; Sung-min Chi; Kyoung-seon Kim; Won-Sun Kim; Han-Ku Cho; Sang-Jun Choi; Man-Hyoung Ryoo


Archive | 2007

Oligomer probe array with improved signal-to-noise ratio fabrication method thereof

Jung-Hwan Hah; Sung-min Chi; Kyoung-seon Kim; Won-Sun Kim

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