Kyoung-seon Kim
Samsung
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Publication
Featured researches published by Kyoung-seon Kim.
Soft Matter | 2010
Seung Hak Park; Dong Ok Shin; Bong Hoon Kim; Dong Ki Yoon; Kyoung-seon Kim; Si Yong Lee; Seok-Hwan Oh; Seong-Woon Choi; Sang Chul Jeon; Sang Ouk Kim
We present block copolymer multiple patterning as an efficient and truly scalable nanolithography for sub-20 nm scale patterning, synergistically integrated with conventional ArF lithography. The directed assembly of block copolymers on chemically patterned substrates prepared by ArF lithography generated linear vertical cylinder arrays with a 20 to 30 nm diameter, enhancing the pattern density of the underlying chemical patterns by a factor of two or three. This self-assembled resolution enhancement technique affords a straightforward route to highly ordered sub-20 nm scale features via conventional lithography.
Proceedings of SPIE | 2013
Jaewoo Nam; Eun Sung Kim; Dae-Keun Kang; Hangeun Yu; Kyoung-seon Kim; Shi-Yong Yi; Chul-Ho Shin; Ho-Kyu Kang
Directed self-assembly (DSA) process of block copolymers (BCPs) has been considered as a candidate for sub-20nm contact patterning. In recent years the semiconductor manufacturers have been interested in use DSA in production. DSA is based on the intrinsic property of the BCPs which is phase-separation in the molecular scale, but significant problems remain for device application. Process time, high process temperature, defect, and CD distribution make the using of DSA difficult in mass production. One of the most considered problems for DSA is the CD Distribution. A guide material for grapho-epitaxy DSA process requires resistance against high temperature and solvent. We use negative tone develop (NTD) photoresist (PR) guide for simple process and thermal resistance, and additional treatment for resistance against high temperature and solvent. The CD distribution of DSA is highly related to the phase separation itself. In order to get better performance, the polymer chains should have sufficient mobility under heating above their glass temperature. Therefore, film thickness and molecular weight of BCPs are very important parameters for CD distribution of DSA process. From the results, it is proven that guide materials, film thickness of BCPs, and molecular weight of BCPs are significant parameter in order to improve CD distribution of DSA patterns.
Archive | 2009
Dong Ki Yoon; Shi-Yong Yi; Seok-Hwan Oh; Kyoung-seon Kim; Sang Ouk Kim; Seung-hak Park
Archive | 2008
Won-Sun Kim; Jung-Hwan Hah; Sung-min Chi; Kyoung-seon Kim; Man-Hyoung Ryoo
Archive | 2007
Jung-Hwan Hah; Sung-min Chi; Kyoung-seon Kim; Won-Sun Kim
Archive | 2008
Sun-Ok Jung; Song-Jun Choi; Man-Hyoung Ryoo; Sung-min Chi; Jung-Hwan Hah; Kyoung-seon Kim; Won-Sun Kim
Archive | 2007
Jung-Hwan Hah; Sung-min Chi; Kyoung-seon Kim; Won-Sun Kim
Archive | 2007
Won-Sun Kim; Sung-min Chi; Jung-Hwan Hah; Kyoung-seon Kim
Archive | 2007
Jung-Hwan Hah; Sung-min Chi; Kyoung-seon Kim; Won-Sun Kim; Han-Ku Cho; Sang-Jun Choi; Man-Hyoung Ryoo
Archive | 2007
Jung-Hwan Hah; Sung-min Chi; Kyoung-seon Kim; Won-Sun Kim