Lizhong Sun
Applied Materials
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Publication
Featured researches published by Lizhong Sun.
international interconnect technology conference | 2001
Shijian Li; Lizhong Sun; Stan D. Tsai; Feng Q. Liu; Liang Chen
Traditional slurry copper (Cu) CMP processes have disadvantages in terms of dishing, erosion, Cu and oxide losses, micro-scratches and cost due in part to the presence of abrasive particles during polishing. A stable abrasive-free (AF) Cu CMP process and a low-abrasive barrier removal process have been developed. With these processes it has been possible to repeatably demonstrate metal-residue free wafers with low dishing, low erosion, low metal and oxide losses, over-polishing insensitivity, and low cost.
Archive | 2003
Paul D. Butterfield; Liang-Yuh Chen; Yongqi Hu; Antoine P. Manens; Rashid Mavliev; Stan D. Tsai; Feng Q. Liu; Ralph M. Wadensweiler; Lizhong Sun; Siew Neo; Alain Duboust
Archive | 1999
Lizhong Sun; Stan D. Tsai; Fred C. Redeker
Archive | 2001
Lizhong Sun; Stan D. Tsai; Fritz Redeker
Archive | 2002
Alain Duboust; Shou-sung Chang; Liang-Yuh Chen; Yan Wang; Siew Neo; Lizhong Sun; Feng Q. Liu
Archive | 2005
Lizhong Sun; Feng Q. Liu; Siew Neo; Stan D. Tsai; Liang-Yuh Chen
Archive | 2001
Alain Duboust; Lizhong Sun; Feng Q. Liu; Yuchun Wang; Yan Wang; Siew Neo; Liang-Yuh Chen
Archive | 2002
Stan D. Tsai; Rashid Mavliev; Lizhong Sun; Feng Q. Liu; Liang-Yuh Chen; Ratson Morad
Archive | 2001
Lizhong Sun; Stan D. Tsai; Shijian Li
Archive | 2000
Stan D. Tsai; Lizhong Sun; Shijian Li
