Siew Neo
Applied Materials
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Publication
Featured researches published by Siew Neo.
international interconnect technology conference | 2000
Srinivas Gandikota; Alain Duboust; Siew Neo; Liang-Yuh Chen; Robin Cheung; Dan Carl
The electro-chemical deposition of copper can carried out by normal DC plating or using pulse plating approach. The superfill for gap fill can be achieved using either of these approaches-DC plating or pulse plating. The pulse plating approach has been observed to show advantages of greater tolerance to seed layer morphology besides controlled planarity, with no major detrimental effects on electrical yield or other film properties.
Archive | 2003
Paul D. Butterfield; Liang-Yuh Chen; Yongqi Hu; Antoine P. Manens; Rashid Mavliev; Stan D. Tsai; Feng Q. Liu; Ralph M. Wadensweiler; Lizhong Sun; Siew Neo; Alain Duboust
Archive | 2002
Alain Duboust; Shou-sung Chang; Liang-Yuh Chen; Yan Wang; Siew Neo; Lizhong Sun; Feng Q. Liu
Archive | 2005
Lizhong Sun; Feng Q. Liu; Siew Neo; Stan D. Tsai; Liang-Yuh Chen
Archive | 2001
Alain Duboust; Lizhong Sun; Feng Q. Liu; Yuchun Wang; Yan Wang; Siew Neo; Liang-Yuh Chen
Archive | 2006
Alain Duboust; Shou-sung Chang; Wei Lu; Siew Neo; Yan Wang; Antoine P. Manens; Yongsik Moon
Archive | 2002
Alain Duboust; Yan Wang; Siew Neo; Liang-Yuh Chen
Archive | 2004
Yan Wang; Siew Neo; Feng Liu; Stan D. Tsai; Yongqi Hu; Alain Duboust; Antoine P. Manens; Ralph M. Wadensweiler; Rashid Mavliev; Liang-Yuh Chen; Donald J. K. Olgado; Paul D. Butterfield; Ming-Kuei Tseng; Shou-sung Chang; Lizhong Sun
Archive | 2003
Yan Wang; Feng Q. Liu; Alain Duboust; Siew Neo; Liang-Yuh Chen; Yongqi Hu
Archive | 2002
Lizhong Sun; Liang-Yuh Chen; Siew Neo; Feng Q. Liu; Alain Duboust; Stan D. Tsai; Rashid Mavliev
