M. Lingalugari

Four-State Sub-12-nm FETs Employing Lattice-Matched II–VI Barrier Layers

Three-state behavior has been demonstrated in Si and InGaAs field-effect transistors (FETs) when two layers of cladded quantum dots (QDs), such as SiOx-cladded Si or GeOx-cladded Ge, are assembled on the thin tunnel gate insulator. This paper describes FET structures that have the potential to exhibit four states. These structures include: (1) quantum dot gate (QDG) FETs with dissimilar dot layers, (2) quantum dot channel (QDC) with and without QDG layers, (3) spatial wavefunction switched (SWS) FETs with multiple coupled quantum well channels, and (4) hybrid SWS–QDC structures having multiple drains/sources. Four-state FETs enable compact low-power novel multivalued logic and two-bit memory architectures. Furthermore, we show that the performance of these FETs can be enhanced by the incorporation of II–VI nearly lattice-matched layers in place of gate oxides and quantum well/dot barriers or claddings. Lattice-matched high-energy gap layers cause reduction in interface state density and control of threshold voltage variability, while providing a higher dielectric constant than SiO2. Simulations involving self-consistent solutions of the Poisson and Schrödinger equations, and transfer probability rate from channel (well or dot layer) to gate (QD layer) are used to design sub-12-nm FETs, which will aid the design of multibit logic and memory cells.

Novel Multistate Quantum Dot Gate FETs Using SiO2 and Lattice-Matched ZnS-ZnMgS-ZnS as Gate Insulators

Multistate behavior has been achieved in quantum dot gate field-effect transistor (QDGFET) configurations using either SiOx-cladded Si or GeOx-cladded Ge quantum dots (QDs) with asymmetric dot sizes. An alternative method is to use both SiOx-cladded Si and GeOx-cladded Ge QDs in QDGFETs. In this paper, we present experimental verification of four-state behavior observed in a QDGFET with cladded Si and Ge dots site-specifically self-assembled in the gate region over a thin SiO2 tunnel layer on a Si substrate. This paper also investigates the use of lattice-matched high-κ ZnS-ZnMgS-ZnS layers as a gate insulator in mixed-dot Si QDGFETs. Quantum-mechanical simulation of the transfer characteristic (ID–VG) shows four-state behavior with two intermediate states between the conventional ON and OFF states.

Ge-ZnSSe Spatial Wavefunction Switched (SWS) FETs to Implement Multibit SRAMs and Novel Quaternary Logic

This paper describes novel multibit static random-access memories (SRAMs) implemented using four-channel spatial wavefunction switched field-effect transistors (SWS FETs) with Ge quantum wells and ZnSSe barriers. A two-bit SRAM cell consists of two back-to-back connected four-channel SWS FETs, where each SWS FET serves as a quaternary inverter. This architecture results in a reduction of the field-effect transistor (FET) count by 75% and data interconnect density by 50%. The designed two-bit SRAM cell is simulated using Berkeley short-channel insulated-gate field-effect transistor equivalent-channel models (for 25-nm FETs). In addition, the binary interface logic and conversion circuitry are designed to integrate the SWS SRAM technology. Our motivation is to stack up multiple bits on a single SRAM cell without multiplying the transistor count. The concept of spatial wavefunction switching (SWS) in the FET structure has been verified experimentally for two- and four-well structures. Quantum simulations exhibiting SWS in four-well Ge SWS FET structures, using the ZnSe/ZnS/ZnMgS/ZnSe gate insulator, are presented. These structures offer higher contrast than Si-SiGe SWS FETs.

Quantum Dot Channel (QDC) Field Effect Transistors (FETs) and Floating Gate Nonvolatile Memory Cells

This paper presents silicon quantum dot channel (QDC) field effect transistors (FETs) and floating gate nonvolatile memory structures. The QDC-FET operation is explained by carrier transport in narrow mini-energy bands which are manifested in an array of SiOx-cladded silicon quantum dot layers. For nonvolatile memory structures, simulations of electron charge densities in the floating quantum dot layers are presented. Experimental threshold voltage shift in ID–VG characteristics is presented after the ‘Write’ cycle. The QDC-FETs and nonvolatile memory due to improved threshold voltage variations by incorporating the lattice-matched II–VI layer as the gate insulator.

Multi-Bit Quantum Dot Nonvolatile Memory (QDNVM) Using Cladded Germanium and Silicon Quantum Dots

In this paper, we are experimentally demonstrating the multi-bit storage of a nonvolatile memory device with cladded quantum dots as the floating gate. These quantum dot nonvolatile memory (QDNVM) devices were fabricated by using standard complementary metal-oxide-semiconductor (CMOS) process. The quantum dots in the floating gate region assembled using site-specific selfassembly (SSA) technique. Quantum mechanical simulations of this device structure are also presented. The experimental results show that the voltage separation between the bits was 0.15V and the voltage pulses required to write these bits were 11.7V and 30V. These devices demonstrated the larger write voltage separation between the bits.

Quantum Dot Gate Three-State and Nonvolatile Memory Field-Effect Transistors Using a ZnS/ZnMgS/ZnS Heteroepitaxial Stack as a Tunnel Insulator on Silicon-on-Insulator Substrates

This paper describes the use of II–VI lattice-matched gate insulators in quantum dot gate three-state and flash nonvolatile memory structures. Using silicon-on-insulator wafers we have fabricated GeOx-cladded Ge quantum dot (QD) floating gate nonvolatile memory field-effect transistor devices using ZnS-Zn0.95Mg0.05S-ZnS tunneling layers. The II–VI heteroepitaxial stack is nearly lattice-matched and is grown using metalorganic chemical vapor deposition on a silicon channel. This stack reduces the interface state density, improving threshold voltage variation, particularly in sub-22-nm devices. Simulations using self-consistent solutions of the Poisson and Schrödinger equations show the transfer of charge to the QD layers in three-state as well as nonvolatile memory cells.