Mark S. Hlad

Device packaging with substrates having embedded lines and metal defined pads

Bumpless build-up layer and laminated core hybrid structures and methods of assembling same

ENABLING PACKAGE-ON-PACKAGE (POP) PAD SURFACE FINISHES ON BUMPLESS BUILD-UP LAYER (BBUL) PACKAGE

SUBSTRATE PACKAGE WITH THROUGH HOLES FOR HIGH SPEED I/O FLEX CABLE

METHODS FOR FABRICATING FINE LINE/SPACE (FLS) ROUTING IN HIGH DENSITY INTERCONNECT (HDI) SUBSTRATES

Method of making substrate package with through holes for high speed I/O flex cable

Organic thin film passivation of metal interconnections

NON-CYLINDRICAL CONDUCTING SHAPES IN MULTILAYER LAMINATED SUBSTRATE CORES

Substrate conductor structure and method

Providing a void-free filled interconnect structure in a layer of package substrate