Martin Guttmann

Efficient charge carrier injection into sub-250 nm AlGaN multiple quantum well light emitting diodes

The design and Mg-doping profile of AlN/Al0.7Ga0.3N electron blocking heterostructures (EBH) for AlGaN multiple quantum well (MQW) light emitting diodes (LEDs) emitting below 250 nm was investigated. By inserting an AlN electron blocking layer (EBL) into the EBH, we were able to increase the quantum well emission power and significantly reduce long wavelength parasitic luminescence. Furthermore, electron leakage was suppressed by optimizing the thickness of the AlN EBL while still maintaining sufficient hole injection. Ultraviolet (UV)-C LEDs with very low parasitic luminescence (7% of total emission power) and external quantum efficiencies of 0.19% at 246 nm have been realized. This concept was applied to AlGaN MQW LEDs emitting between 235 nm and 263 nm with external quantum efficiencies ranging from 0.002% to 0.93%. After processing, we were able to demonstrate an UV-C LED emitting at 234 nm with 14.5 μW integrated optical output power and an external quantum efficiency of 0.012% at 18.2 A/cm2.

Improved injection efficiency in 290 nm light emitting diodes with Al(Ga)N electron blocking heterostructure

The effect of different Al(Ga)N electron blocking heterostructures (EBH) on the emission spectra and light output power of 290 nm light emitting diodes (LEDs) has been investigated. The carrier injection and internal quantum efficiency of the LEDs is simulated and compared to electroluminescence measurements. The highest light output power has been found for LEDs with an Mg-doped AlN/Al0.7Ga0.3N EBH with an AlN layer thickness >3 nm. The output power of these LEDs was 8.5-times higher compared to LEDs without EBH. This effect is attributed to an improved carrier injection and confinement which prevents electron leakage into the p-doped region of the LED with a simultaneously enhanced hole injection into the active region.

High-power UV-B LEDs with long lifetime

UV light emitters in the UV-B spectral range between 280 nm and 320 nm are of great interest for applications such as phototherapy, gas sensing, plant growth lighting, and UV curing. In this paper we present high power UV-B LEDs grown by MOVPE on sapphire substrates. By optimizing the heterostructure design, growth parameters and processing technologies, significant progress was achieved with respect to internal efficiency, injection efficiency and light extraction. LED chips emitting at 310 nm with maximum output powers of up to 18 mW have been realized. Lifetime measurements show approximately 20% decrease in emission power after 1,000 operating hours at 100 mA and 5 mW output power and less than 30% after 3,500 hours of operation, thus indicating an L50 lifetime beyond 10,000 hours.

Strongly transverse-electric-polarized emission from deep ultraviolet AlGaN quantum well light emitting diodes

The optical polarization of emission from ultraviolet (UV) light emitting diodes (LEDs) based on (0001)-oriented AlxGa1−xN multiple quantum wells (MQWs) has been studied by simulations and electroluminescence measurements. With increasing aluminum mole fraction in the quantum well x, the in-plane intensity of transverse-electric (TE) polarized light decreases relative to that of the transverse-magnetic polarized light, attributed to a reordering of the valence bands in AlxGa1−xN. Using k ⋅ p theoretical model calculations, the AlGaN MQW active region design has been optimized, yielding increased TE polarization and thus higher extraction efficiency for bottom-emitting LEDs in the deep UV spectral range. Using (i) narrow quantum wells, (ii) barriers with high aluminum mole fractions, and (iii) compressive growth on patterned aluminum nitride sapphire templates, strongly TE-polarized emission was observed at wavelengths as short as 239 nm.

AlGaN-based deep UV LEDs grown on sputtered and high temperature annealed AlN/sapphire

The performance characteristics of AlGaN-based deep ultraviolet light emitting diodes (UV-LEDs) grown by metalorganic vapor phase epitaxy on sputtered and high temperature annealed AlN/sapphire templates are investigated and compared with LEDs grown on epitaxially laterally overgrown (ELO) AlN/sapphire. The structural and electro-optical properties of the devices on 350 nm sputtered and high temperature annealed AlN/sapphire show similar defect densities and output power levels as LEDs grown on low defect density ELO AlN/sapphire templates. After high temperature annealing of the 350 nm sputtered AlN, the full widths at half maximum of the (0002) and (101¯2) reflections of the high resolution x-ray diffraction rocking curves decrease by one order of magnitude to 65 arc sec and 240 arc sec, respectively. The curvature of the sputtered and HTA AlN/sapphire templates after regrowth with 400 nm MOVPE AlN is with −80 km−1 much lower than the curvature of the ELO AlN/sapphire template of −160 km−1. The on-wafer...

Role of substrate quality on the performance of semipolar (112¯2) InGaN light-emitting diodes

We compare the optical properties and device performance of unpackaged InGaN/GaN multiple-quantum-well light-emitting diodes (LEDs) emitting at ∼430 nm grown simultaneously on a high-cost small-size bulk semipolar ( 112¯2) GaN substrate (Bulk-GaN) and a low-cost large-size ( 112¯2) GaN template created on patterned ( 101¯2) r-plane sapphire substrate (PSS-GaN). The Bulk-GaN substrate has the threading dislocation density (TDD) of ∼105 cm−2–106 cm−2 and basal-plane stacking fault (BSF) density of 0 cm−1, while the PSS-GaN substrate has the TDD of ∼2 × 108 cm−2 and BSF density of ∼1 × 103 cm−1. Despite an enhanced light extraction efficiency, the LED grown on PSS-GaN has two-times lower internal quantum efficiency than the LED grown on Bulk-GaN as determined by photoluminescence measurements. The LED grown on PSS-GaN substrate also has about two-times lower output power compared to the LED grown on Bulk-GaN substrate. This lower output power was attributed to the higher TDD and BSF density.

Degradation effects of the active region in UV-C light-emitting diodes

An extensive analysis of the degradation characteristics of AlGaN-based ultraviolet light-emitting diodes emitting around 265 nm is presented. The optical power of LEDs stressed at a constant dc current of 100 mA (current density = 67 A/cm2 and heatsink temperature = 20 °C) decreased to about 58% of its initial value after 250 h of operation. The origin of this degradation effect has been studied using capacitance-voltage and photocurrent spectroscopy measurements conducted before and after aging. The overall device capacitance decreased, which indicates a reduction of the net charges within the space-charge region of the pn-junction during operation. In parallel, the photocurrent at excitation energies between 3.8 eV and 4.5 eV and the photocurrent induced by band-to-band absorption in the quantum barriers at 5.25 eV increased during operation. The latter effect can be explained by a reduction of the donor concentration in the active region of the device. This effect could be attributed to the compensation of donors by the activation or diffusion of acceptors, such as magnesium dopants or group-III vacancies, in the pn-junction space-charge region. The results are consistent with the observed reduction in optical power since deep level acceptors can also act as non-radiative recombination centers.

Gas Sensing of Nitrogen Oxide Utilizing Spectrally Pure Deep UV LEDs

In this paper, we will present the development of a compact LED-based optical gas sensing system in the ultraviolet-C spectral region. This includes the design of the LED heterostructure emitting near 226 nm, the development of an LED chip, and the implementation into a gas sensing system capable of detecting nitrogen oxide concentrations in the ppm range.

Current spreading in UV-C LEDs emitting at 235 nm

We present UV-C LEDs emitting around 235 nm grown by MOVPE on ELO AlN/sapphire substrates. In order to account for the low conductivity of high Al content AlGaN layers and the associated high contact resistances, we designed an optimized compact LED geometry based on electro-thermal simulations of the current spreading. Experimental data (layer and contact resistances) are collected on test structures and used as input parameters for 3-D current spreading simulations. With resistances of the layers (n and p) approaching 0.1 Ωcm, the use of a segmented p-area with broad n-contact fingers (10 μm or more) that are close to the mesa edge (5 μm) help to maximize the emission power in the center of the structure. Based on this knowledge a series of compact LEDs of size 500 μm x 500 μm is designed and simulated. We get confirmation that the segmentation of the p-area is the most critical parameter to limit the non-uniformity introduced by the high n-sheet resistances. Up to 17% in emission power can be gained when the n-contacts are designed properly. LEDs with the optimum geometry were processed and measured. We get a good confirmation of our model concerning the distribution of the emission power. Both simulations and measurements show current crowding at the edge of the n-contact, however the power loss in the middle of the chip is higher than predicted.

Improved light extraction and quantum efficiencies for UVB LEDs with UV-transparent p-AlGaN superlattices (Conference Presentation)

Light emitting diodes (LEDs) in the UVB (280 nm – 315 nm) spectral range are of particular interest for applications such as plant growth lighting or phototherapy. In fact, LEDs offer numerous advantages compared to conventional ultraviolet light sources such as a tunable emission wavelength, a small form factor, and a minimal environmental impact. State-of-the-art devices utilize p-GaN and low aluminum mole fraction p-AlGaN layers to enable good ohmic contacts and low series resistances. However, these layers are also not transparent to UVB light thus limiting the light extraction efficiency (LEE). The exploitation of UV-transparent p-AlGaN layers together with high reflective metal contacts may significantly increase the LEE. In this paper, the output power of LEDs emitting at 310 nm with a UV-transparent and absorbing Mg-doped AlGaN superlattice is compared. A three-fold increase of the output power was observed for LEDs with UV-transparent p-AlGaN layers. To investigate these findings, LEDs with low reflective Ni/Au and high reflective Al contacts are fabricated and characterized. Together with ray tracing simulations and detailed measurements of the metal reflectivities, we were able to determine the LEE and the internal quantum efficiency (IQE). According to on-wafer measurements, the external quantum efficiency (EQE) increases from 0.3% for an absorbing p-Al0.2Ga0.8N/Al0.4Ga0.6N-superlattice with Ni/Au contacts to 0.9% for a UV-transparent p-Al0.4Ga0.6N/Al0.6Ga0.4N-superlattice with Al contacts. This 3× enhancement of the EQE can be partially ascribed to an improved LEE (from 4.5% to 7.5%) in combination with a 1.8× increase of the IQE when using a p-Al0.4Ga0.6N/Al0.6Ga0.4N-superlattice instead of a p-Al0.2Ga0.8N/Al0.4Ga0.6N-superlattice.