Matt E. Schwab

Solder resist opening to define a combination pin one indicator and fiducial

Method of making a semiconductor device having an opening in a solder mask

Multi-chip module and methods

Routing element for use in multi-chip modules, multi-chip modules including the routing element, and methods

Bond pad rerouting element, rerouted semiconductor devices including the rerouting element, stacked chip assemblies including the rerouted semiconductor devices, and methods

Packaged microdevices and methods for manufacturing packaged microdevices

Bond pad rerouting element and stacked semiconductor device assemblies including the rerouting element

Bond pad rerouting element, rerouted semiconductor devices including the rerouting element, and assemblies including the rerouted semiconductor devices

Methods for designing bond pad rerouting elements for use in stacked semiconductor device assemblies and for assembling semiconductor devices

Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor components