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Brad D. Rumsey

Micron Technology

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Publication

Featured researches published by Brad D. Rumsey.

Archive | 1999

Controlling packaging encapsulant leakage

Patrick W. Tandy; Joseph M. Brand; Brad D. Rumsey; Steven R. Stephenson; David J. Corisis; Todd O. Bolken; Edward A. Schrock; Brenton L. Dickey

Archive | 2002

Solder resist opening to define a combination pin one indicator and fiducial

Brad D. Rumsey; Matt E. Schwab

Archive | 2004

Method of making a semiconductor device having an opening in a solder mask

Brad D. Rumsey; Matt E. Schwab

Archive | 2002

Method and apparatus for marking and identifying a defective die site

Brad D. Rumsey

Archive | 2001

Method and apparatus for reduced flash encapsulation of microelectronic devices

Brad D. Rumsey; Todd O. Bolken; Cary J. Baerlocher

Archive | 2001

Apparatus for reduced flash encapsulation of microelectronic devices

Brad D. Rumsey; Todd O. Bolken; Cary J. Baerlocher

Archive | 2000

Apparatus and method for reducing interposer compression during molding process

Stephen L. James; Brad D. Rumsey

Archive | 2002

Soldermask opening to prevent delamination

Brad D. Rumsey

Archive | 2002

Gate area relief strip for a molded I/C package

Stephen L. James; Richard W. Wensel; Brad D. Rumsey

Archive | 2006

Positioning flowable solder for bonding integrated circuit elements

Brad D. Rumsey

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Matt E. Schwab

Micron Technology

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Todd O. Bolken

Micron Technology

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Cary J. Baerlocher

Micron Technology

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Stephen L. James

Micron Technology

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Brenton L. Dickey

Micron Technology

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David J. Corisis

Micron Technology

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Edward A. Schrock

Micron Technology

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Joseph M. Brand

Micron Technology

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Patrick W. Tandy

Micron Technology

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Steven R. Stephenson

Micron Technology

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