Brad D. Rumsey

Controlling packaging encapsulant leakage

Solder resist opening to define a combination pin one indicator and fiducial

Method of making a semiconductor device having an opening in a solder mask

Method and apparatus for marking and identifying a defective die site

Method and apparatus for reduced flash encapsulation of microelectronic devices

Apparatus for reduced flash encapsulation of microelectronic devices

Apparatus and method for reducing interposer compression during molding process

Soldermask opening to prevent delamination

Gate area relief strip for a molded I/C package

Positioning flowable solder for bonding integrated circuit elements