Tracy V. Reynolds

Integrated circuit package alignment feature

Integrated circuit package including lead frame with electrically isolated alignment feature

Routing element for use in multi-chip modules, multi-chip modules including the routing element, and methods

Apparatus for forming wire bonds from circuitry on a substrate to a semiconductor chip, and methods of forming semiconductor chip assemblies

Method and apparatus for circuit completion through the use of ball bonds or other connections during the formation of semiconductor device

Bond pad rerouting element, rerouted semiconductor devices including the rerouting element, stacked chip assemblies including the rerouted semiconductor devices, and methods

Packaged microdevices and methods for manufacturing packaged microdevices

Bond pad rerouting element and stacked semiconductor device assemblies including the rerouting element

Bond pad rerouting element, rerouted semiconductor devices including the rerouting element, and assemblies including the rerouted semiconductor devices

Apparatus and method for providing mechanically pre-formed conductive leads