Network


Latest external collaboration on country level. Dive into details by clicking on the dots.

Hotspot


Dive into the research topics where Matthias Förster is active.

Publication


Featured researches published by Matthias Förster.


winter simulation conference | 2016

Simulation-enabled development lot journey smoothening in a fully-utilised semiconductor manufacturing line

Wolfgang Scholl; Matthias Förster; Patrick Preuss; Andre Naumann; Boon Ping Gan; Peter Lendermann

Technology and product development have high priority in an advanced semiconductor manufacturing facility such as the Infineon Dresden fab. From the perspective of line performance this means that short cycle times for development lots have to be guaranteed to enable the required learning cycles. Long-term simulation is used in dynamic capacity planning to find a compromise between short cycle times for the development corridor and high utilisation of the installed tool capacity. All products in the fab run with customer-specific due dates. As such, negative side-effects caused by the accelerated development lot corridor through increased dispatch priorities have to be minimised. In turn, for day-to-day operations short-term simulation is used for early detection of bottleneck situations and other sudden resource availability problems. With focus on the development corridor, a Lot Cycle Time Forecaster was realised. The aforementioned manifold applications of discrete-event simulation are described in this paper in more detail.


Archive | 2001

Method for fabricating a trench capacitor

Matthias Förster; Jörn Lützen; Martin Gutsche; Anja Morgenschweis


Archive | 2001

Process for producing a microroughness on a surface

Matthias Förster; Anja Morgenschweis; Torsten Martini; Jens-Uwe Sachse


Archive | 2002

Method for fabricating a trench capacitor for a semiconductor memory

Matthias Förster; Kristin Schupke; Anja Morgenschweis; Anett Moll; Jens-Uwe Sachse


Archive | 2004

Semiconductor structure manufacturing method especially for deep trench memory circuits made with sub-100 nm technology, whereby doped silicon is deposited over the trench structure using on over-conforming separation method

Andreas Dietel; Matthias Förster; Jochen Geidl; Moritz Haupt; Wilhelm Kegel; Michael Stadtmüller; Olaf Storbeck


Archive | 2004

Überkonformes Herstellungsverfahren für eine Halbleiterstruktur

Andreas Dietel; Matthias Förster; Jochen Geidl; Moritz Haupt; Wilhelm Kegel; Michael Stadtmüller; Olaf Storbeck


Archive | 2004

Überkonformes Herstellungsverfahren für eine Halbleiterstruktur About compliant manufacturing method of a semiconductor structure

Andreas Dietel; Matthias Förster; Jochen Geidl; Moritz Haupt; Wilhelm Kegel; Michael Stadtmüller; Olaf Storbeck


Archive | 2003

Schichtstapel und Verfahren zur Herstellung eines Schichtstapels

Matthias Förster; Matthias Goldbach; Gerhard Kunkel


Archive | 2003

Layer stack used in semiconductor industry comprises photoresist layer arranged on reflection-reducing layer made from semiconducting or insulating base material on substrate

Matthias Förster; Matthias Goldbach; Gerhard Kunkel


Archive | 2001

Process for forming microroughness on a surface

Matthias Förster; Torsten Martini; Anja Dr. Morgenschweiss; Jens-Uwe Sachse

Collaboration


Dive into the Matthias Förster's collaboration.

Top Co-Authors

Avatar
Top Co-Authors

Avatar
Top Co-Authors

Avatar
Top Co-Authors

Avatar
Top Co-Authors

Avatar
Top Co-Authors

Avatar
Top Co-Authors

Avatar
Top Co-Authors

Avatar
Top Co-Authors

Avatar
Researchain Logo
Decentralizing Knowledge