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Michael Stadtmüller

Infineon Technologies

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Publication

Featured researches published by Michael Stadtmüller.

Archive | 2003

Method for minimizing the vapor deposition of tungsten oxide during the selective side wall oxidation of tungsten-silicon gates

Olaf Storbeck; Wilhelm Kegel; Jens-Uwe Sachse; Michael Stadtmüller; Regina Hayn; Erwin Schoer; Georg Roters; Steffen Frigge

Archive | 2004

Trench capacitor structure and process for applying a covering layer and a mask for trench etching processes in semiconductor substrates

Henry Bernhardt; Michael Stadtmüller; Olaf Storbeck; Stefan Kainz

Archive | 2002

Method for minimizing tungsten oxide evaporation during selective sidewall oxidation of tungsten-silicon gates

Steffen Frigge; Wilhelm Kegel; Jens-Uwe Sachse; Michael Stadtmüller; Regina Hayn; Georg Roters; Erwin Schoer; Olaf Storbeck

Archive | 2006

Speicher und Verfahren zu seiner Herstellung

Stefan Jaschik; Alejandro Avellan; Uwe Dr. Schröder; Andreas Orth; Matthias Goldbach; Olaf Storbeck; Michael Stadtmüller; Thomas Hecht

Archive | 2005

Trenchkondensatorstruktur und Verfahren zum Aufbringen einer Deckschicht sowie einer Maske für Trenchätzprozesse in Halbleitersubstraten

Henry Bernhardt; Olaf Storbeck; Michael Stadtmüller; Stefan Kainz

Archive | 2004

Semiconductor structure manufacturing method especially for deep trench memory circuits made with sub-100 nm technology, whereby doped silicon is deposited over the trench structure using on over-conforming separation method

Andreas Dietel; Matthias Förster; Jochen Geidl; Moritz Haupt; Wilhelm Kegel; Michael Stadtmüller; Olaf Storbeck

Archive | 2004

Trench capacitor structure and method for applying a cover layer and a mask in semiconductor substrates for Trenchätzprozesse

Henry Bernhardt; Stefan Kainz; Michael Stadtmüller; Olaf Storbeck

Archive | 2004

Überkonformes Herstellungsverfahren für eine Halbleiterstruktur

Andreas Dietel; Matthias Förster; Jochen Geidl; Moritz Haupt; Wilhelm Kegel; Michael Stadtmüller; Olaf Storbeck

Archive | 2004

Verfahren zum Einbringen eines Grabens in ein Halbleitersubstrat sowie zum Aufbringen einer Deckschicht A method for introducing a trench in a semiconductor substrate and for depositing a covering layer

Henry Bernhardt; Stefan Kainz; Michael Stadtmüller; Olaf Storbeck

Archive | 2004

Überkonformes Herstellungsverfahren für eine Halbleiterstruktur About compliant manufacturing method of a semiconductor structure

Andreas Dietel; Matthias Förster; Jochen Geidl; Moritz Haupt; Wilhelm Kegel; Michael Stadtmüller; Olaf Storbeck

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Olaf Storbeck

Qimonda

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Henry Bernhardt

Infineon Technologies

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Stefan Kainz

Infineon Technologies

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Wilhelm Kegel

Infineon Technologies

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Andreas Dietel

Infineon Technologies

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Jochen Geidl

Infineon Technologies

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Matthias Förster

Infineon Technologies

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Moritz Haupt

Infineon Technologies

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Erwin Schoer

Infineon Technologies

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Georg Roters

Infineon Technologies

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