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Publication
Featured researches published by Michael Frank Cina.
electronic components and technology conference | 1992
Kenneth P. Jackson; E.B. Flint; Michael Frank Cina; D.L. Lacey; Jean M. Trewhella; T. Caulfield; S. Sibley
A compact, planar-processed package using flip-chip, self-aligned optoelectronic components is described. The packaging concepts are compatible with existing high-speed, high-density electronic materials and processes and therefore have the potential for high-volume, low-cost manufacturing. The concepts are demonstrated using a four-channel transceiver module utilizing planar-processed optical waveguides and flip-chip optoelectronic components. An overview of the package is presented, and the substrate, the optoelectronic chip alignment, the module connector, and link tests are described.<<ETX>>
IEEE Photonics Technology Letters | 1991
Mitchell S. Cohen; Michael Frank Cina; E. Bassous; Modest M. Oprysko; J.L. Speidell
A method for packaging a laser-fiber module was explored in which the critical laser-fiber alignment is carried out not with the usual active means, i.e., with the laser activated, but by a passive method based on the registration principles of photolithography. The method relies on an index scheme in which fiducial marks are lithographically placed on the laser chip and on a fiber carrier. At 850 nm, using the index technique with cleaved multimode fibers, it was possible to achieve the same laser-fiber coupling efficiency as attained by active alignment; with cleaved single-mode fibers about 80% of the active-alignment coupling efficiency was achieved.<<ETX>>
electronic components and technology conference | 1992
Mitchell S. Cohen; Michael Frank Cina; E. Bassous; Modest M. Oprysko; J.L. Speidell; F.J. Canora; M.J. Defranza
A novel method for packaging a laser-fiber module is explored in which the critical laser-fiber alignment is carried out not with the usual active means, i.e., with the laser activated, but by a passive method based on the registration principles of photolithography. The novel method relies on an index scheme in which fiducial marks are lithographically placed on the laser chip and on a fiber carrier. At 850 nm, using the index technique with cleaved multimode fibers, it has been possible to achieve the same laser-fiber coupling efficiency as attained by active alignment; with cleaved single-mode fibers about 80% of the active-alignment coupling efficiency was achieved. Details of the novel index-alignment method are discussed, and a brief description of an improved computer-controlled version of the apparatus is given.<<ETX>>
Optoelectronic Materials, Devices, Packaging, and Interconnects II | 1989
Kenneth P. Jackson; A.J. Moll; Ephraim Bemis Flint; Michael Frank Cina
Two fiber-optic coupling approaches are described for providing accurate and simultaneous alignment between four multimode fibers and a four-channel GaAs laser and detector array. The fiber-detector array coupling approach provides less than 0.2 dB loss with better than -20 dB optical crosstalk between adjacent channels. The fiber-laser array coupling approach provides -3 dB coupling loss for each of four fiber-laser channels.
Archive | 1995
Michael Frank Cina; Mitchell S. Cohen; Glen Walden Johnson; Modest M. Oprysko; Jeannine M. Trewhella
Archive | 1991
Michael Frank Cina; Mitchell S. Cohen; Ephraim Bemis Flint; Kurt R. Grebe; Douglas Joe Hall; Kenneth P. Jackson; Modest M. Oprysko
Archive | 1996
Michael Frank Cina; Ephraim Bemis Flint; Brian P. Gaucher; Young H. Kwark; Modest M. Oprysko; William Edward Pence; Saila Ponnapalli
Archive | 1997
Troy J. Beukema; Michael Frank Cina; Ephraim Bemis Flint; Brian P. Gaucher; Young H. Kwark; Modest M. Oprysko; William Edward Pence; Saila Ponnapalli
Archive | 1994
Michael Frank Cina; Dennis L. Karst; Modest M. Oprysko; Mark B. Ritter; Stephen Louis Spanoudis; Jeannine M. Trewhella
Archive | 1996
Frank J. Canora; Michael Frank Cina; Brian P. Gaucher; Paul F. Greier; Richard I. Kaufman; Alphonso Philip Lanzetta; Lawrence Shungwei Mok; Robert Stephen Olyha; Saila Ponnapalli; John L. Staples