Kenneth P. Jackson

A compact multichannel transceiver module using planar-processed optical waveguides and flip-chip optoelectronic components

A compact, planar-processed package using flip-chip, self-aligned optoelectronic components is described. The packaging concepts are compatible with existing high-speed, high-density electronic materials and processes and therefore have the potential for high-volume, low-cost manufacturing. The concepts are demonstrated using a four-channel transceiver module utilizing planar-processed optical waveguides and flip-chip optoelectronic components. An overview of the package is presented, and the substrate, the optoelectronic chip alignment, the module connector, and link tests are described.<<ETX>>

A high-density, four-channel, OEIC transceiver module utilizing planar-processed optical waveguides and flip-chip, solder-bump technology

An optoelectronic transceiver module is described consisting of a four-channel AlGaAs integrated laser/monitor transmitter and a four-channel GaAs MESFET integrated detector/preamp receiver. The optoelectronic chips are flip-chip, solder-bump bonded to a substrate containing electrical wiring and planar-processed optical waveguides. The optical waveguide layer serves two purposes: the routing of optical signals, as well providing mechanical registrations for the optoelectronic chips and fiber-optic ribbon connector. The work described here demonstrates one approach to high-density, optoelectronic array packaging compatible with existing high-performance electronic packaging technology. >

Optical Fiber Coupling Approaches For Multi-Channel Laser And Detector Arrays

Two fiber-optic coupling approaches are described for providing accurate and simultaneous alignment between four multimode fibers and a four-channel GaAs laser and detector array. The fiber-detector array coupling approach provides less than 0.2 dB loss with better than -20 dB optical crosstalk between adjacent channels. The fiber-laser array coupling approach provides -3 dB coupling loss for each of four fiber-laser channels.

GaAs fiber-optic modules for optical data processing networks

A high-speed, highly integrated fiber-optic data communications link is described. It consists of a transmitter module containing a GaAs integrated circuit and a laser array with fiber array pigtail, and a receiver module containing a GaAs OEIC with a fiber array pigtail. The performance of the link at 1 Gb/s is presented with emphasis on the crosstalk and noise issues with those high levels of integration. Measured error rates as low as 10/sup -15/ confirm that these highly integrated link adapters are suitable for use in data processing networks. >

Emcore's 1 Gb/s to 25 Gb/s VCSELs

Emcores 850 nm UltralaseTM VCSELs, operating at a data rate from 1 Gb/s to 25 Gb/s, is presented. They were based on our low-cost and hermetic-by-design chip platform which contains the same element for either singlets or arrays with a 250 μm pitch. First, we discuss high-speed VCSEL evolutions, device designs, manufacturing processes, and device characteristics. Secondly, we present performance of Emcores TOSAs, 40 Gb/s parallel optic modules (S12), 120 Gb/s CXP modules, active connect cables (40 Gb/s QDR and 56 Gb/s FDR), as well as comprehensive reliability qualifications of UltralaseTM VCSELs. Lastly, we briefly go over the recent progress of 20 Gb/s and 25 Gb/s VCSEL developments. We have successfully achieved a 3dB bandwidth of 15 GHz at 85°C and 8 mA for a 7.5 μm aperture UltralaseTM VCSEL.

Exploring the limits of high-speed receivers for multimode VCSEL-based optical links

We present complete characterizations of multimode GaAs photodetectors for high-speed VCSEL-based optical links and compare SiGe receiver IC performances in a 62Gbps back-to-back link for different photodiode designs.

Low-cost, compact, gigabit transceivers for data communication

Gigabit fiber-optic data links for use in box-to-box computer interconnects are becoming increasingly common due primarily to the high data rate-distance capability, better EMC/EMI performance and smaller size of the optical fiber technology. However, these advantages alone do not necessarily justify the use of fiber optic interconnects. Fiber optic interconnects must also be comparable in cost to copper ones especially as the distance between boxes shrinks. In this paper, industry trends in technology development that will further cost reduce gigabit fiber optic data communications transceivers will be discussed.

The next generation high data rate VCSEL development at SEDU

In May of 2012, Emcore’s VCSEL FAB and VCSEL based transceiver business joined Sumitomo Electric Device Innovations USA (SEDU). After this change of ownership, our high speed VCSEL development effort continues. In this paper, we will report the progress we made in the past year in our 25Gbps to 28Gbps VCSEL. This next generation device is targeted for EDR, 32GFC as well as other optical interconnect applications.

VCSEL-Based Transceivers for Data Communications

The data communications (datacom) transceiver market has experienced tremendous growth over the last fifteen years due in large part to the use of vertical-cavity surface-emitting lasers (VCSELs) and multimode optical fibers. This chapter reviews the evolution of 850 nm laser-based datacom transceivers beginning with the early use of AlGaAs edge-emitters to the adoption of VCSELs where their unique attributes have enabled significant performance enhancements and cost reductions in transceiver designs.

Compact planar-processed package for multichannel, fiber-optic computer interconnects

Monolithic arrays of AlGaAs lasers, GaAs OEICs (optoelectronic integrated circuits) and multimode optical fibers are becoming increasingly attractive for use in high-speed cost sensitive, short distance (<1 km) computer interconnections.1 However, for the technology to be pervasive, optoelectronic packaging, which today involves robotically aligned and assembled precision machined components, must be advanced, in favor of planar-processed packages, utilizing batch fabrication and assembly techniques, compatible with arrays of optoelectronic devices.